This paper presents an interconnect and packaging solution for millimetre-wave MMIC, based on collective wiring and surface mount technologies.
The designed structure consists of an SMT CSP (Chip Scale
Package) mounted on printed circuit board (PCB).
This packaging concept has been applied to a millimetre-wave
LNA and has been measured up to 60 GHz, exhibiting
results close to bare die measurements (insertion loss per
millimetre-wave transition lower than 0.5dB) and
demonstrating the potential of this technology up to V-band