This paper describes the design and development of Ku and C band solid state switch matrix for multimedia satellite payloads. The design, through the use of advanced packaging techniques, allows significant savings on mass and volume with respect to traditional electromechanical switches while guaranteeing a comparable reliability

Colicchia, L.

Comparini, M.C.

Di Nardo, S.

Giordano, M.

Leone, C.

Ranieri, P.

Suriani, A.

Tursini, M.

English

AMS Acta

  Ku & C BAND SOLID STATE SWITCH MATRIX FOR SATELLITE PAYLOADS  USING LTCC MULTILAYER SUBSTRATE  L. Colicchia, M.C. Comparini, S. Di Nardo, C. Leone, M. Giordano, P.Ranieri, A.Suriani, M. Tursini Alenia Spazio -Via Saccomuro 24, 00131 Rome, Italy phone: 39-06-4151.2583 - fax: 39-06-4151.2507 - email p.ranieri@roma.alespazio.it   Abstract  This paper describes the design and development of Ku and C band solid state switch matrix for multimedia satellite payloads. The design, through the use of advanced packaging techniques, allows significant savings on mass and volume with respect to traditional electromechanical switches while guaranteeing a comparable reliability.   Introduction  In the last years the satellite applications have seen a strong increase in the space hardware demands mainly for commercial communication services. Present satellite applications, both for commercial communication services and for scientific missions, demand for reduction of dimension and weight, lower recurring costs, improved reliability and high performances. The market demand for new services implies a fast evolution of the satellite configuration and architecture. Basic trends are the communication to/from ground at higher frequencies, increase in the payload capacity, the use of OBP (On-Board Processing) and baseband on-board switching network, the need for crosslink communication to relay intersatellite data. In addition to the said growth in number of transponders per satellite, the trend towards multibeam payloads with high number of spot beams and frequency reuse, together with the need for a high flexibility on the up&down links frequency plans, allowing  adjustment of the capacity allocation, justify a development effort in the area of the switching provisions foreseen for reconfiguration as well as redundancy. Advanced technologies like GaAs MMIC, Microwave Hybrid Integrated Circuit packaging, advanced ceramic substrates for high density multi-chip modules (thin and thick film on Al2O3, LTCC) allow to realise solid state switch matrices with significant reduction of size and mass and higher reliability   Ku & C Band switch matrix design  The Ku band switch matrix has been developed for a multimedia payload to perform the connection between 10 RF input signals coming from the RF Front End (RFE) and 12 demodulation units (UMCD); 10 of the latter are used as nominal units and the other 2 operate for redundancy purposes. The same type of matrix allows similar connections in a section of the payload which works in C band. The unit has 10 RF inputs and 12 RF outputs and any input may be connected to three outputs to ensure the proper connections between the RFEs and the UMCDs in case of failure of two UMCDs. The block diagram of the matrix is shown in fig.1. In table 1 the principal specifications of the matrix are reported The major issue of this kind of unit at these frequencies is the isolation. Each MMIC switch guarantees 30 dB of isolation so for each switched off path the theoretical isolation is 60 dB. To have a real isolation which is compliant to the specification it is very important to minimise the unavoidable coupling between different RF paths in the cavity. As it is possible to see from the block diagram, when using a planar structure some intersection between RF paths are necessary. These intersections are very critical, in fact it is not possible to realise them with simple airbridges because they don’t guarantee the necessary isolation. So a three-dimensional structure has been designed: in fact with this one the intersections are avoided by using microstrip and stripline on different planes; this structure may be realised with multilayer LTTC substrate.   The LTCC substrate, in addition to its suitabilility for this microwave application, is convenient in that it allows also to realise on a unique ceramic both microwave and control sections. The RF cavity is isolated with a kovar frame brazed on the top of the ceramic.   The use of a single substrate, in addition to cost reduction, allows more flexibility in the DC connection. In fact it must be considered that each MMIC switch needs six DC controls: such a large number of connections can’t be placed on the same plane as the RF paths; using this substrate it is possible with via holes to bring the controls on lower planes isolated from the RF part. Moreover the use of coaxial feedthroughs from the control section to the microwave cavity is avoided.  The most critical points for the RF path are the transitions between microstrip and stripline. In order to properly design them, electromagnetic simulations have been performed; in fig.2 and fig. 3 a picture of the transition and the results of the simulation are respectively shown.   As it is possible to see from fig. 2 a reactive element, a microstrip stub, has been placed close to the transition to compensate the inductance of the via hole and of the wire bonding [1]. To properly isolate the striplines from the rest of the substrate additional ground-via holes has been placed adjacently to the stripline; the distance among the ground vias and the distance between this ground-vias barrier and the stripline, are also parameters which have been optimised [2].   On the basis of these simulations an SP2T block has been realised. This block, whose schematic and picture are respectively shown in figure 4 and figure 5, represent the building block of the whole RF part of the matrix which will be constituted of a serial repetition of it.   Experimental results  The building block has been tested and the results are reported in the next figures. The fig. 6 and fig. 7 show the insertion loss of the two RF paths in Ku band: the differences in the value are primarily due to the length difference. Fig. 8 shows Input Return Loss and the Isolation in Ku band,  fig. 9 shows the Insertion Loss of a path in C band and fig 10 the Input Return Loss and the Isolation in C band.  The unavoidable cross-talks have reduced the isolation, especially in Ku band, but however all the values are in the specification.   Future works  On the basis of the results of the RF building block the next step is the realisation of the whole switch matrix which will be constituted of a RF section including a serial repetition of the building block and a control section. Both sections will be placed on the same LTCC multilayer substrate which will be epoxy attached on a kovar housing   Conclusions  Design and performance of a solid state switch matrix, used for redundancy and reconfiguration of demodulation resources on board a multimedia payload, was demonstrated. Large savings in terms of mass are achieved with the solid state approach with respect to traditional solutions. The design employs LTCC as a medium for both microwave transmission and for integration of control circuitry.  References  [1] W. Simon et al. “Interconnects and transition in Multilayer LTTC multichip modules for 24 GHz ISM-band applications” – 2000 IEEE MTT-S Proceedings [2] W. Simon et al. “Design of passive components for K-Band Comunication modules in LTCC environment ” – 1999 International symposium on Microelectronics Proceedings     Parameter Unit SpecificationFrequency GHz 4.8 – 6.2 , 10 - 13Insertion Loss dB <8I/O Return Loss dB >15Isolation dBc ≥40 SP3TSWITCHSP3TSWITCHSP3TSWITCHSP3TSWITCHSP3TSWITCHSP3TSWITCHRF OUT 1 RF OUT 2 RF OUT 3 RF OUT 12RF IN 1 RF IN 2 RF IN 3 RF IN 10SP3TSWITCHSP3TSWITCH…….…….Table 1: Spec of the matrix                         Figure 1: Block diagram of the matrix     6 7 8 9 10 11 12 13-45-40-35-30-25-20-15-10-50S11S21f(GHz)dB Fig. 2 : ustrip – stripline – ustrip transition Fig. 3:  e.m. simulation of the transition   SP3TSWITCHSP3TSWITCHSP3TSWITCHRF OUT 1 RF OUT 2RF INMicrostripStriplineMicrostripMicrostrip RF INRF OUT 1RF OUT 2MicrostripStriplineMMIC SWITCH  Figure 4: Block diagram of the RF building block Figure 5 : Picture of the RF building block     Figure 6: Switch matrix insertion loss through µstrip RF path in Ku band Figure 7: Switch matrix insertion loss through µstrip-stripline- µstrip  RF path in Ku band      Figure 8: Input Return loss and Isolation in Ku band Figure 9: Switch matrix insertion loss through µstrip-stripline- µstrip  RF path in C band                        Figure 10: Input Return loss and Isolation in C band        

Ku & C Band solid state switch matrix for satellite payloads using LTCC multilayer substrate

AMS Acta - Alm@DL - Università di Bologna

  
Ku & C BAND SOLID STATE SWITCH MATRIX FOR SATELLITE PAYLOADS 
 USING LTCC MULTILAYER SUBSTRATE 
 
L. Colicchia, M.C. Comparini, S. Di Nardo, C. Leone, M. Giordano, P.Ranieri, A.Suriani, M. Tursini 
Alenia Spazio -Via Saccomuro 24, 00131 Rome, Italy 
phone: 39-06-4151.2583 - fax: 39-06-4151.2507 - email p.ranieri@roma.alespazio.it 
 
 
Abstract 
 
This paper describes the design and development of Ku and C band solid state switch matrix for multimedia satellite 
payloads. The design, through the use of advanced packaging techniques, allows significant savings on mass and 
volume with respect to traditional electromechanical switches while guaranteeing a comparable reliability. 
 
 
Introduction 
 
In the last years the satellite applications have seen a strong increase in the space hardware demands mainly for 
commercial communication services. Present satellite applications, both for commercial communication services and 
for scientific missions, demand for reduction of dimension and weight, lower recurring costs, improved reliability and 
high performances. The market demand for new services implies a fast evolution of the satellite configuration and 
architecture. Basic trends are the communication to/from ground at higher frequencies, increase in the payload capacity, 
the use of OBP (On-Board Processing) and baseband on-board switching network, the need for crosslink 
communication to relay intersatellite data. In addition to the said growth in number of transponders per satellite, the 
trend towards multibeam payloads with high number of spot beams and frequency reuse, together with the need for a 
high flexibility on the up&down links frequency plans, allowing  adjustment of the capacity allocation, justify a 
development effort in the area of the switching provisions foreseen for reconfiguration as well as redundancy. 
Advanced technologies like GaAs MMIC, Microwave Hybrid Integrated Circuit packaging, advanced ceramic 
substrates for high density multi-chip modules (thin and thick film on Al2O3, LTCC) allow to realise solid state switch 
matrices with significant reduction of size and mass and higher reliability 
 
 
Ku & C Band switch matrix design 
 
The Ku band switch matrix has been developed for a multimedia payload to perform the connection between 10 RF 
input signals coming from the RF Front End (RFE) and 12 demodulation units (UMCD); 10 of the latter are used as 
nominal units and the other 2 operate for redundancy purposes. The same type of matrix allows similar connections in a 
section of the payload which works in C band. 
The unit has 10 RF inputs and 12 RF outputs and any input may be connected to three outputs to ensure the proper 
connections between the RFEs and the UMCDs in case of failure of two UMCDs. The block diagram of the matrix is 
shown in fig.1. In table 1 the principal specifications of the matrix are reported 
The major issue of this kind of unit at these frequencies is the isolation. Each MMIC switch guarantees 30 dB of 
isolation so for each switched off path the theoretical isolation is 60 dB. To have a real isolation which is compliant to 
the specification it is very important to minimise the unavoidable coupling between different RF paths in the cavity. As 
it is possible to see from the block diagram, when using a planar structure some intersection between RF paths are 
necessary. These intersections are very critical, in fact it is not possible to realise them with simple airbridges because 
they don’t guarantee the necessary isolation. So a three-dimensional structure has been designed: in fact with this one 
the intersections are avoided by using microstrip and stripline on different planes; this structure may be realised with 
multilayer LTTC substrate.  
 
The LTCC substrate, in addition to its suitabilility for this microwave application, is convenient in that it allows also to 
realise on a unique ceramic both microwave and control sections. The RF cavity is isolated with a kovar frame brazed 
on the top of the ceramic.  
 
The use of a single substrate, in addition to cost reduction, allows more flexibility in the DC connection. In fact it must 
be considered that each MMIC switch needs six DC controls: such a large number of connections can’t be placed on the 
same plane as the RF paths; using this substrate it is possible with via holes to bring the controls on lower planes 
isolated from the RF part. Moreover the use of coaxial feedthroughs from the control section to the microwave cavity is 
avoided. 
 
The most critical points for the RF path are the transitions between microstrip and stripline. In order to properly design 
them, electromagnetic simulations have been performed; in fig.2 and fig. 3 a picture of the transition and the results of 
the simulation are respectively shown. 
  
As it is possible to see from fig. 2 a reactive element, a microstrip stub, has been placed close to the transition to 
compensate the inductance of the via hole and of the wire bonding [1]. To properly isolate the striplines from the rest of 
the substrate additional ground-via holes has been placed adjacently to the stripline; the distance among the ground vias 
and the distance between this ground-vias barrier and the stripline, are also parameters which have been optimised [2]. 
 
 
On the basis of these simulations an SP2T block has been realised. This block, whose schematic and picture are 
respectively shown in figure 4 and figure 5, represent the building block of the whole RF part of the matrix which will 
be constituted of a serial repetition of it. 
 
 
Experimental results 
 
The building block has been tested and the results are reported in the next figures. The fig. 6 and fig. 7 show the 
insertion loss of the two RF paths in Ku band: the differences in the value are primarily due to the length difference. 
Fig. 8 shows Input Return Loss and the Isolation in Ku band,  fig. 9 shows the Insertion Loss of a path in C band and fig 
10 the Input Return Loss and the Isolation in C band.  The unavoidable cross-talks have reduced the isolation, especially 
in Ku band, but however all the values are in the specification. 
 
 
Future works 
 
On the basis of the results of the RF building block the next step is the realisation of the whole switch matrix which will 
be constituted of a RF section including a serial repetition of the building block and a control section. Both sections will 
be placed on the same LTCC multilayer substrate which will be epoxy attached on a kovar housing 
 
 
Conclusions 
 
Design and performance of a solid state switch matrix, used for redundancy and reconfiguration of demodulation 
resources on board a multimedia payload, was demonstrated. Large savings in terms of mass are achieved with the solid 
state approach with respect to traditional solutions. The design employs LTCC as a medium for both microwave 
transmission and for integration of control circuitry. 
 
References 
 
[1] W. Simon et al. “Interconnects and transition in Multilayer LTTC multichip modules for 24 GHz ISM-band 
applications” – 2000 IEEE MTT-S Proceedings 
[2] W. Simon et al. “Design of passive components for K-Band Comunication modules in LTCC environment 
” – 1999 International symposium on Microelectronics Proceedings 
 
 
 
 
Parameter Unit Specification
Frequency GHz 4.8 – 6.2 , 10 - 13
Insertion Loss dB <8
I/O Return Loss dB >15
Isolation dBc ≥40
 
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
RF OUT 1 RF OUT 2 RF OUT 3 RF OUT 12
RF IN 1 RF IN 2 RF IN 3 RF IN 10
SP3T
SWITCH
SP3T
SWITCH
…….
…….
Table 1: Spec of the matrix                         Figure 1: Block diagram of the matrix 
 
  
 
6 7 8 9 10 11 12 13
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
S11
S21
f(GHz)
dB
 
Fig. 2 : ustrip – stripline – ustrip transition Fig. 3:  e.m. simulation of the transition 
 
 
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
RF OUT 1 RF OUT 2
RF IN
Microstrip
Stripline
Microstrip
Microstrip
 
RF IN
RF OUT 1RF OUT 2
Microstrip
Stripline
MMIC SWITCH  
Figure 4: Block diagram of the RF building block Figure 5 : Picture of the RF building block 
 
 
  
Figure 6: Switch matrix insertion loss through µstrip RF path 
in Ku band 
Figure 7: Switch matrix insertion loss through µstrip-
stripline- µstrip  RF path in Ku band 
  
 
 
 
Figure 8: Input Return loss and Isolation in Ku band Figure 9: Switch matrix insertion loss through µstrip-
stripline- µstrip  RF path in C band 
  
  
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Figure 10: Input Return loss and Isolation in C band 
 
 
 
 
  
 


 
 
Ku & C BAND SOLID STATE SWITCH MATRIX FOR SATELLITE PAYLOADS 
 USING LTCC MULTILAYER SUBSTRATE 
 
L. Colicchia, M.C. Comparini, S. Di Nardo, C. Leone, M. Giordano, P.Ranieri, A.Suriani, M. Tursini 
Alenia Spazio -Via Saccomuro 24, 00131 Rome, Italy 
phone: 39-06-4151.2583 - fax: 39-06-4151.2507 - email p.ranieri@roma.alespazio.it 
 
 
Abstract 
 
This paper describes the design and development of Ku and C band solid state switch matrix for multimedia satellite 
payloads. The design, through the use of advanced packaging techniques, allows significant savings on mass and 
volume with respect to traditional electromechanical switches while guaranteeing a comparable reliability. 
 
 
Introduction 
 
In the last years the satellite applications have seen a strong increase in the space hardware demands mainly for 
commercial communication services. Present satellite applications, both for commercial communication services and 
for scientific missions, demand for reduction of dimension and weight, lower recurring costs, improved reliability and 
high performances. The market demand for new services implies a fast evolution of the satellite configuration and 
architecture. Basic trends are the communication to/from ground at higher frequencies, increase in the payload capacity, 
the use of OBP (On-Board Processing) and baseband on-board switching network, the need for crosslink 
communication to relay intersatellite data. In addition to the said growth in number of transponders per satellite, the 
trend towards multibeam payloads with high number of spot beams and frequency reuse, together with the need for a 
high flexibility on the up&down links frequency plans, allowing  adjustment of the capacity allocation, justify a 
development effort in the area of the switching provisions foreseen for reconfiguration as well as redundancy. 
Advanced technologies like GaAs MMIC, Microwave Hybrid Integrated Circuit packaging, advanced ceramic 
substrates for high density multi-chip modules (thin and thick film on Al2O3, LTCC) allow to realise solid state switch 
matrices with significant reduction of size and mass and higher reliability 
 
 
Ku & C Band switch matrix design 
 
The Ku band switch matrix has been developed for a multimedia payload to perform the connection between 10 RF 
input signals coming from the RF Front End (RFE) and 12 demodulation units (UMCD); 10 of the latter are used as 
nominal units and the other 2 operate for redundancy purposes. The same type of matrix allows similar connections in a 
section of the payload which works in C band. 
The unit has 10 RF inputs and 12 RF outputs and any input may be connected to three outputs to ensure the proper 
connections between the RFEs and the UMCDs in case of failure of two UMCDs. The block diagram of the matrix is 
shown in fig.1. In table 1 the principal specifications of the matrix are reported 
The major issue of this kind of unit at these frequencies is the isolation. Each MMIC switch guarantees 30 dB of 
isolation so for each switched off path the theoretical isolation is 60 dB. To have a real isolation which is compliant to 
the specification it is very important to minimise the unavoidable coupling between different RF paths in the cavity. As 
it is possible to see from the block diagram, when using a planar structure some intersection between RF paths are 
necessary. These intersections are very critical, in fact it is not possible to realise them with simple airbridges because 
they don’t guarantee the necessary isolation. So a three-dimensional structure has been designed: in fact with this one 
the intersections are avoided by using microstrip and stripline on different planes; this structure may be realised with 
multilayer LTTC substrate.  
 
The LTCC substrate, in addition to its suitabilility for this microwave application, is convenient in that it allows also to 
realise on a unique ceramic both microwave and control sections. The RF cavity is isolated with a kovar frame brazed 
on the top of the ceramic.  
 
The use of a single substrate, in addition to cost reduction, allows more flexibility in the DC connection. In fact it must 
be considered that each MMIC switch needs six DC controls: such a large number of connections can’t be placed on the 
same plane as the RF paths; using this substrate it is possible with via holes to bring the controls on lower planes 
isolated from the RF part. Moreover the use of coaxial feedthroughs from the control section to the microwave cavity is 
avoided. 
 
The most critical points for the RF path are the transitions between microstrip and stripline. In order to properly design 
them, electromagnetic simulations have been performed; in fig.2 and fig. 3 a picture of the transition and the results of 
the simulation are respectively shown. 
 
 
As it is possible to see from fig. 2 a reactive element, a microstrip stub, has been placed close to the transition to 
compensate the inductance of the via hole and of the wire bonding [1]. To properly isolate the striplines from the rest of 
the substrate additional ground-via holes has been placed adjacently to the stripline; the distance among the ground vias 
and the distance between this ground-vias barrier and the stripline, are also parameters which have been optimised [2]. 
 
 
On the basis of these simulations an SP2T block has been realised. This block, whose schematic and picture are 
respectively shown in figure 4 and figure 5, represent the building block of the whole RF part of the matrix which will 
be constituted of a serial repetition of it. 
 
 
Experimental results 
 
The building block has been tested and the results are reported in the next figures. The fig. 6 and fig. 7 show the 
insertion loss of the two RF paths in Ku band: the differences in the value are primarily due to the length difference. 
Fig. 8 shows Input Return Loss and the Isolation in Ku band,  fig. 9 shows the Insertion Loss of a path in C band and fig 
10 the Input Return Loss and the Isolation in C band.  The unavoidable cross-talks have reduced the isolation, especially 
in Ku band, but however all the values are in the specification. 
 
 
Future works 
 
On the basis of the results of the RF building block the next step is the realisation of the whole switch matrix which will 
be constituted of a RF section including a serial repetition of the building block and a control section. Both sections will 
be placed on the same LTCC multilayer substrate which will be epoxy attached on a kovar housing 
 
 
Conclusions 
 
Design and performance of a solid state switch matrix, used for redundancy and reconfiguration of demodulation 
resources on board a multimedia payload, was demonstrated. Large savings in terms of mass are achieved with the solid 
state approach with respect to traditional solutions. The design employs LTCC as a medium for both microwave 
transmission and for integration of control circuitry. 
 
References 
 
[1] W. Simon et al. “Interconnects and transition in Multilayer LTTC multichip modules for 24 GHz ISM-band 
applications” – 2000 IEEE MTT-S Proceedings 
[2] W. Simon et al. “Design of passive components for K-Band Comunication modules in LTCC environment 
” – 1999 International symposium on Microelectronics Proceedings 
 
 
 
 
Parameter Unit Specification
Frequency GHz 4.8 – 6.2 , 10 - 13
Insertion Loss dB <8
I/O Return Loss dB >15
Isolation dBc ≥40
 
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
RF OUT 1 RF OUT 2 RF OUT 3 RF OUT 12
RF IN 1 RF IN 2 RF IN 3 RF IN 10
SP3T
SWITCH
SP3T
SWITCH
…….
…….
Table 1: Spec of the matrix                         Figure 1: Block diagram of the matrix 
 
 
 
 
6 7 8 9 10 11 12 13
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
S11
S21
f(GHz)
dB
 
Fig. 2 : ustrip – stripline – ustrip transition Fig. 3:  e.m. simulation of the transition 
 
 
SP3T
SWITCH
SP3T
SWITCH
SP3T
SWITCH
RF OUT 1 RF OUT 2
RF IN
Microstrip
Stripline
Microstrip
Microstrip
 
RF IN
RF OUT 1RF OUT 2
Microstrip
Stripline
MMIC SWITCH  
Figure 4: Block diagram of the RF building block Figure 5 : Picture of the RF building block 
 
 
  
Figure 6: Switch matrix insertion loss through µstrip RF path 
in Ku band 
Figure 7: Switch matrix insertion loss through µstrip-
stripline- µstrip  RF path in Ku band 
 
 
 
 
 
Figure 8: Input Return loss and Isolation in Ku band Figure 9: Switch matrix insertion loss through µstrip-
stripline- µstrip  RF path in C band 
  
  
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Figure 10: Input Return loss and Isolation in C band 
 
 
 
 
 
 
 


Ku & C Band solid state switch matrix for satellite payloads using LTCC multilayer substrate

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