NEPP Mission Statement: Provide NASAs leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry

Label, Kenneth A.

NASA Technical Reports Server

A Year in the Life of the
NASA Electronic Parts and Packaging 
(NEPP) Program
A NASA Office of Safety and Mission 
Assurance (OSMA) Program
Kenneth A. LaBel,
NEPP Program Co-Manager
ken.label@nasa.gov
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 1
https://ntrs.nasa.gov/search.jsp?R=20170010723 2019-08-31T01:28:42+00:00Z
Acronyms
2To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Acronym Definition 
3D Three Dimensional (3D)
AF Air Force (AF)
AF SMC Air Force Space and Missile Systems Center (AF SMC)
AI Artificial Intelligence (AI)
ARC NASA Ames Research Center (ARC)
BAE BAE Systems (BAE)
BN Bayesian Networks (BN)
BOK Body of Knowledge (BOK)
BYU Brigham Young University (BYU)
CLTs NASA CIO Leadership Teams (CLTs)
CMOS Complementary Metal Oxide Semiconductor (CMOS)
COTS Commercial Off The Shelf (COTS)
CRÈME Cosmic Ray Effects on Micro Electronics
Cu Copper
DDR 
Double Data Rate (DDR) [DDR3 = Generation 3; DDR4 =  
Generation 4]
DiRAM Dis-integrated Random Access Memory (DiRAM)
DLA Defense Logistics Agency (DLA)
DMEA Defense Microelectronics Activity (DMEA)
DoD Department of Defense (DoD)
DOE Department of Energy (DOE)
DRAM Dynamic Random-Access Memory (DRAM)
EEE Electrical, Electronic, and Electromechanical (EEE)
ESA European Space Agency (ESA)
ETW Electronics Technology Workshop (ETW)
FD-SOI Fully-Depleted Silicon-On-Insulator (FD-SOI)
FinFETs Fin Field Effect Transistors (FinFETs)
FPGA Field Programmable Gate Array (FPGA)
GaN Gallium Nitride (GaN)
GIDEP Government-Industry Data Exchange Program (GIDEP)
GPU Graphics Processing Unit (GPU)
GSN Goal Structuring Notation (GSN)
HBM High Bandwidth Memory (HBM)
HPSC High Performance Spacecraft Computing (HPSC)
IC Integrated Circuit (IC)
Acronym Definition 
IR Infrared (IR)
JEDEC Joint Electron Device Engineering Council (JEDEC)
LANL Los Alamos National Laboratories (LANL)
MAIW Military AI Works (MAIW)
MBMA Model-Based Missions Assurance (MBMA)
Mil Military (Mil)
MOSFET Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET)
MPSOC Multi-Processing System on Chip (MPSOC)
NASA National Aeronautics and Space Administration (NASA)
Navy Crane Naval Surface Warfare Center, Crane, Indiana (Navy Crane)
NEPAG NASA EEE Parts Assurance Group (NEPAG)
NEPP NASA Electronic Parts and Packaging (NEPP) Program
NESC NASA National Electric Safety Code (NESC)
NRO United States Navy National Reconnaissance Office (NRO)
OCE Office of the Chief Engineer (OCE)
OSMA NASA Office of Safety and Mission Assurance (OSMA) Program
PBGA Plastic Ball Grid Array 
PoP Package-on-Package (PoP)
QFN Quad-Flat No-Leads (QFN)
R&M Reliability and Maintainability (R&M)
RH Radiation Hardened (RH)
RHA Radiation Hardness Assurance
SAE Society of Automotive Engineers (SAE)
SAPP Space Asset Protection Program (SAPP)
SEAM Systems Engineering and Assurance Modeling (SEAM)
SEB Single Event Burnout (SEB)
SEE Single Event Effect (SEE)
SiC Silicon Carbide (SiC)
SME Small and Medium-sized Enterprises (SME)
SNL Sandia National Laboratories (SNL)
SOC Systems on a Chip (SOC)
STMD NASA's Space Technology Mission Directorate (STMD)
SysML System Modeling Language (SysML)
TOR Technical Operating Report (TOR)
NEPP Mission Statement
Provide NASA’s leadership for 
developing and maintaining guidance 
for the screening, qualification, test, 
and reliable usage of electrical, 
electronic, and electromechanical 
(EEE) parts by NASA, in collaboration 
with other government Agencies and 
industry.
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 3
NEPP - Charter
Mission 
Assurance
Agency Leadership
•NASA Policies and 
Procedures
•Agency Guidelines, 
Body of Knowledge 
(BOK) documents, 
and Best Practices
•Coordination of 
Government and 
Industry Standards
•Audit Coordination 
with AF, NRO, DLA
•Partnering within 
NASA and other 
Agencies, Industry, 
University, and 
International
EEE Parts 
Infrastructure
•NEPAG Telecons and 
Working Groups
•SME Capabilities
•Communication and 
Outreach within NASA 
and to the greater 
aerospace community
EEE Parts Problem 
Investigations
•Agency/Industry-wide 
problems
•GIDEP and NASA Alert 
development
Technology Evaluation
•Advanced /new EEE 
parts/technologies
•Ex. Advanced CMOS, 
GaN, SiC
•Working Groups (NASA 
, government, 
aerospace)
•Screening/qualification/ 
test/usage guidelines
•Partnering: NASA, 
Government Agencies, 
Industry, University, 
International
Trusted and RH 
Electronics
•Collaboration with 
NASA and other 
Agency Supply Chain 
and Trust/Counterfeit 
Electronics 
Organizations
•Support DoD efforts 
on Trusted Foundries 
and FPGAs (w/NASA 
STMD and OCE/Space 
Asset Protection)
•Support DoD RH 
efforts
Agency Priorities –
Independent Support
•Commercial Crew
•Small Mission 
Reliability
•Coordination with 
NASA Consolidation, 
CLTs, NESC, STMD, 
SAPP, and radiation 
block buy
•Collaborate with 
DoD/DOE on space 
radiation test 
infrastructure
4To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
NEPP – Product Delivery
Assurance
BOK
• Technology and 
product status and 
gap analysis
Best Practices 
and Guidelines
• Test, usage, 
screening, 
qualification
• Radiation facility 
studies
NASA EEE Parts 
Policy and 
Standards Government and 
Industry 
Standards 
Representation
• SAE G11/G12/ 
JEDEC JC13
• Aerospace TORs
NEPP Standard 
Products
• Test, summary, and 
audit reports
• Conference and 
workshop 
presentations
• Alerts
Related task areas:
Technology/parts evaluations lead to new best practices, etc…
5To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Body of Knowledge (BOK) Documents
• What goes into a BOK
– An overview of the technology
– An overview of technology applicability to 
space/aeronautics
– An overview of technology maturity, produceability and/or 
commercial availability
– Reliability, qualification, and/or radiation knowledge-base
– Technology direction or extent of the reliability issue for 
the future Identification of experts, technology sources, 
test houses, etc.
– Facilities/capabilities
– Recommendation for follow-on NEPP task (if applicable)
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 6
What’s New for NEPP in FY18
• Increased emphasis on needs of small missions 
such as CubeSats and model-based mission 
assurance (MBMA)
– Partnering with other NASA organizations, Agencies, 
and universities
• More assurance products
– BOKs, Guidelines, Tools, Information Sharing, Training
• Significant update of the NEPP website
– Easier to find guidance and search for data
– New tie-ins to the SmallSat community
• Support for Agency efforts for EEE Parts 
Consolidation, Radiation Beam Block Buys, and 
Capability Leadership Teams
7To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Advanced Technologies
• Technology/device evaluations with a nod to 
developing test methods and user guidance
• New: collaboration with DMEA and 
GlobalFoundries on 22nm FD-SOI and 28nm bulk 
radiation evaluation 
AMD Ryzen Processor
Hynix 3D Flash Memory
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 8
NEPP – Processors, Systems on a Chip (SOC), and 
Field Programmable Gate Arrays (FPGAs)
Best 
Practices 
and 
Guidelines
Radiation 
Hardened 
Processor 
Evaluation
•BAE RAD55XX
•Vorago
(microcontrollers)
•Support High 
Performance 
Spacecraft 
Computing (HPSC)
Graphics 
Processor 
Units (GPUs)
•Intel, AMD, Nvidia
•Enabling data 
processing
State of the Art 
COTS 
Processors
•Sub 32nm CMOS, 
FinFETs, etc
•Samsung, Intel, 
AMD
“Space” FPGAs
•Microsemi RTG4
•Xilinx MPSOC+
•ESA Brave (future)
•“Trusted” FPGA 
(future)
COTS FPGAs
•Xilinx Kintex+
•Mitigation 
evaluation
•TBD: Microsemi 
PolarFire
Partnering
•Processors: Navy 
Crane, BAE/NRO-
•FPGAs: AF SMC, 
SNL, LANL, BYU,…
•Microsemi, Xilinx, 
Synopsis
•Cubic Aerospace
Potential task areas:
artificial intelligence (AI) hardware, Intel Stratix 10
9To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
NEPP – Memories
Best 
Practices 
and 
Guidelines
Commercial Flash
• 3D
• Samsung, Hynix, 
Micron
• Planar – TBD
• Enabling data storage 
density
New materials/ 
architectures
• Resistive
• Fujitsu/Panasonic
• Spin torque transfer 
magnetoresistive
• Avalanche, Everspin
• 3D Xpoint
• Intel Optane
• Enabling “universal” 
memories
DRAMs
• DDR4 test capability (in 
progress)
• Commercial DDR 
(various)
• Tezzaron DiRAM
(w/HPSC)
• Enabling high 
performance 
computing
Partnering
• Navy Crane
• NASA STMD
• Avalanche
• University of Padova
Related task areas:
Deprocessing for single event testing (also w/processors, FPGAs,…)
10To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
NEPP – Packaging
Best 
Practices 
and 
Guidelines
3D
TSV Memories
DDR4
HBM
Non-Hermetic
QFN
PBGA
Daisy Chain
PoP
Thru Mold Via
Substrates
Cobham –
FC/Organic
Cobham –
Cu Pillar
3D Literature 
review
Partnering
• Tezzaron
• Aurora 
Semiconductor
• Xilinx
• Cobham
11To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Working Industry/Agency-Wide 
Concerns
Tantalum capacitor failure
Failure analysis of Schottky 
diode radiation damage
Cross-section of failure 
location
Thermal Image of failure locations
High magnitude optical 
images of failure 
locations
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 12
Vendor Validation Tests
GaN IC – radiation test analysis Comparison of n-type 60V trench 
MOSFET SEB thresholds
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 13
Infrastructure Challenges
Using Proton Cancer Therapy Centers
for electronics testing
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 14
NEPP - Small Mission Efforts
Reliable 
Small 
Missions
Model-Based 
Mission 
Assurance 
(MBMA)
• W NASA R&M 
Program
Best 
Practices and 
Guidelines
COTS and 
Non-Mil Data
SEE 
Reliability 
Analysis CubeSat 
Mission 
Success 
Analysis
CubeSat 
Databases
Working 
Groups
Potential future task areas: automotive and avionics resilience
15To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
NEPP Small Mission Efforts and MBMA
(w/ NASA MBMA Program)
16To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Emerging Modeling
Vanderbilt University
Web-based tool (SEAM)
NASA/GSFC (Campola) - Vanderbilt
Notional RHA Tool (R-GENTIC)
Vanderbilt University
GSN Exemplar (SEE) – complete
TBD
GSN Exemplar – EEE parts reliability
NASA/GSFC (Xapsos) 
RHA Confidence Approach
Vanderbilt University
BN follow-on
BN integrated into SEAM
NASA/GSFC (Berg)
SEE Classic Reliability
NASA/GSFC (Campola)
Small Mission RHA
TBD
Small Mission EEE Parts Best Practices
Saint Louis University
CubeSat Success Study
JPL
CubeSat EEE Parts Databases
TBD
CubeSat EEE Parts Testing
Vanderbilt
CRÈME Toolsuite
Other
Integration with Small 
Spacecraft Virtual Institute 
(NASA/ARC)
https://www.nasa.gov/small
sat-institute
Other
MAIW
SmallSat Reliability Initiative 
(NASA/AF/ others)
TBD
Resilience, autonomy
Aerospace (proposed)
CubeSat Kit Vendor Survey
“Mid-space” Grade Survey and 
Requirements Definition
https://modelbasedassurance.org/ 
Partnering is key
• Within
– NASA
• With
– Other 
government 
agencies
– Industry
– University
– International
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 17
18To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
9th Annual NEPP
Electronics 
Technology 
Workshop (ETW)
Scheduled dates:
June 18-21, 2018
NASA/GSFC and on-line
Radiation Testing
Advanced Technology Reliability
Commercial IC Packaging
Emerging Assurance Methods
(Witulski, Vanderbilt University, NEPP ETW 2017)
http://nepp.nasa.gov
To be presented by Kenneth A. LaBel at the  Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 19


A Year in the Life of the NASA Electronic Parts and Packaging (NEPP) Program

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