Dombrowski, Kai

Fiebig, Norbert

Grass, Eckhard

Jagdhold, Ulrich

Kraemer, Rolf

Krueger, Olaf

Lehman, Jens

Lippert, Gunther

Maehoenen, Patrick

Maharatna, Koushik

Tittelbach, Klaus

Troya, Alfonso

English

Southampton (e-Prints Soton)

030003-1, “Broadband Radio Access Networks (BRAN);

An Algorithm for the Machine Calculation of

Burst Synchronization for OFDM-Based Cellular Systems

Interpolation in Digital Modems – Part I: Fundamentals,”

Multi-Carrier CDMA Mobile Radio Systems – Analysis and Optimization of Detection,

Optimum Receiver Design for Wireless BroadBand Systems Using OFDM -

Performance of Channel Estimation Methods for OFDM Systems in a Multipath Fading Channel,”

Simulation Aspects of an OFDMbased Physical Layer of Wireless Broadband Networks,”

Solution,

On the Single Chip Implementation of a Hiperlan/2 and IEEE802.11a Capable Modem

Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chipBroadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chi

Grass, E

Tittelbach, K

Jagdhold, U

Troya, G

Krueger, O

Lehmann, J

Maharatna, K

Fiebig, N

Dombrowski, K

Kraemer, R

Maehoenen, P

Explore Bristol Research

On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

On the Single Chip Implementation of a Hiperlan/2 and IEEE802.11a Capable Modem

Abstract

Similar works

Full text

Available Versions

Southampton (e-Prints Soton)

Explore Bristol Research