Electronic systems in aerospace and in space exploration missions are expected to encounter extreme temperatures and wide thermal swings. To address the needs for extreme temperature electronics, research efforts exist at the NASA Glenn Research Center (GRC) to develop and evaluate electronics for extreme temperature operations, and to establish their reliability under extreme temperature operation and thermal cycling; conditions that are typical of both the aerospace and space environments. These efforts are supported by the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program and by the NASA Electronic Parts and Packaging (NEPP) Program. This work reports on the results obtained on the development of a temperature sensor geared for use in harsh environments
