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slides
Stress and buckling analysis
Authors
O. W., Jr. Dillon
Publication date
1 October 1984
Publisher
Abstract
An analysis is presented of elastic stress and buckling behavior due to thermal stresses in silicon ribbon. Thermal profiles for reducing stresses and improving flatness in wide ribbon are discussed
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oai:casi.ntrs.nasa.gov:1985002...
Last time updated on 31/05/2013