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Method and apparatus for preparing multiconductor cable with flat conductors

Abstract

A method and apparatus for preparing flat conductor cable having a plurality of ribbon-like conductors disposed upon and adhesively bonded to the surface of a substrate is described. The conductors are brought into contact with the substrate surface, and while maintained in axial tension on said substrate, the combination is seated on a yieldably compressible layer to permit the conductor to become embedded into the surface of the substrate film

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