A system for and method of contact-electrifying a dielectric to determine its electrostatic properties is described. The dielectric is placed in contact with a contact plate means, and connected to a voltage source means to charge the contact plate and to contact-electrify the dielectric. The contact plate means is disconnected from the voltage source and a charge sensor means monitors the rate of decay of the charge on the dielectric. If a conductive path from the contact plate to ground is desired, a lead may be connected between the conductor and ground. Automatic timing and charge monitoring are preferred for maximum accuracy, especially where dielectrics treated with antistatic agents are tested
