Tool operates by applying force perpendicularly to socket plane. Tool can be operated in cramped or confined quarters and can effect integrated circuit removal without damage. It may also be useful to hold nut or bolt in confined space while tightening, when it is not possible to use conventional tool

Marzek, R. A.

Read, W. S.

English

NASA Technical Reports Server

U] Juary 1975	 B74-10281 
NASA TECH BRIEF 
NASA Pasadena Office 
NASA Tech Briefs announce new technology derived from the U.S. space program. They are issued to encourage 
commercial application. Tech Briefs are available on a subscription basis from the National Technical Information 
Service, Springfield, Virginia 22151. Requests for individual copies or questions relating to the Tech Brief program may 
be directed to the Technology Utilization Office, NASA, Code KT, Washington, D.C. 20546. 
Straight-Line IC Removal Tool 
The problem: 
Multipin dual in-line packaged (DIP) integrated 
circuits (IC's) which are installed in sockets must 
occasionally be removed for test or replacement. To 
remove them, a substantial force must be applied to 
dislodge the pins from the socket receptacles. To 
avoid bending or breaking any of the pins, the force 
must be applied in a line which is perpendicular to the 
socket plane. Makeshift tools which apply force at one 
end of an IC often cause damage to the IC or the 
socket as removal is effected.
The solution: 
A removal tool which operates by applying force 
perpendicularly to the socket plane has been devised. 
The tool can be operated in cramped or confined 
quarters and can effect IC removal without damage. 
Retainer N.
Engagement 
Knob 
Sliding 
Lift Bed
	 Wedge	 Finger 
Grips 
Lifting 
Finger	
Housing 
Lift-Bed 
Retaining Pin 
Vertical Guide 
Slot 
Lifting-
Finger 
Pivot Pin
Closed Position 
.
Open Position 
Straight-Line IC Removal Tool
(continued overleaf) 
This document was prepared under the sponsorship of the National
	
Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States 	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States 	 will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19740000281 2020-03-17T14:19:21+00:00Z
How it's done: 
The removal tool (see figure) has a small lift bed 
which is placed under the IC body and which can be 
raised straight up by means of a wedge-and-cam 
mechanism. While designed for the purpose of 
removing IC's, the tool can also be used to remove 
other devices where the application of a force 
perpendicular to the mounting surface is required. It 
may also be useful to hold a nut or a bolt in a confined 
space while tightening, when it is not possible to use a 
conventional tool. The lift bed, which is interchange-
able, may have a retaining slot on its upper surface 
to mate with the fastener or other member which is to 
be held in position. 
Note: 
Requests for further information may be directed 
to:
Technology Utilization Officer 
NASA Pasadena Office 
4800 Oak Grove Drive 
Pasadena, California 91103 
Reference: TSP74-10281
Patent status: 
This invention has been patented by NASA (U.S. 
Patent No. 3,832,764). Inquiries concerning non-
exclusive or exclusive license for its commercial 
development should be addressed to: 
Patent Counsel 
NASA Pasadena Office 
4800 Oak Grove Drive 
Pasadena, California 91103 
Source: Ronald A. Marzek and

William S. Read of

Caltech/JPL
under contract to

NASA Pasadena Office

(NPO-13157) 
Categories: 01 (Electronics - Components and 
Circuitry) 
B74-10281	 07 (Machinery)


Straight-line IC removal tool

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