Document is summary of approaches that may be taken in designing hybrid microcircuits similar to those for aerospace application

Brandewie, J. V.

Mckee, W. D., Jr.

Poole, A. P., Jr.

Varga, J. E.

English

NASA Technical Reports Server

July 1972	 B72-10393 
NASA TECH BRIEF 
Marshall Space Flight Center 
NASA Tech Briefs announce new technology derived from the U.S. space program. They are issued to encourage 
commercial application. Tech Briefs are available on a subscription basis from the National Technical Information 
Service, Springfield, Virginia 22151. Requests for individual copies or questions relating to the Tech Brief program may 
be directed to the Technology Utilization Office, NASA, Code KT, Washington, D.C. 20546. 
Guidelines for Fabrication of Hybrid Microcircuits 
The document on Guidelines for Fabrication of Hybrid 
Microcircuits is a summary of the approaches that may 
be taken in designing hybrid microcircuits similar to those 
used for application in an aerospace program. The hand-
book was intended primarily for use by electronic-circuits 
engineers on the Space Shuttle Program as a guide in 
selection of microcircuits. The very nature of hybrid 
microcircuits and the history of their development and 
manufacture by any one company lead naturally to a 
number of design approaches. Those applicable to 
modern high-reliability electronics are examined and 
evaluated. It has been recognized that it is neither 
economical nor practical to prescribe one set of design 
approaches, even for one of the many classes of hybrids, 
since in many cases there are trade-offs yielding no 
distinct differences in the all-important reliability area. 
Nevertheless, important differences do occur in some 
functions and in the manner in which process steps are 
controlled. It is intended that sufficient distinction has 
been made in these areas to permit use of these guide-
lines for at least an initial reliability assessment of hybrid 
microcircuits. 
Description is made of latest good practice for re-
liability in hybrids, and layout and design from the 
electronic, geometric, mechanical, and thermal points of 
view are covered in some detail. Packages are discussed 
with regard to layout and design, integrity, and the next 
level of system interconnection. Parts selection, evalu-
ation, and procurement control are discussed. Extensive 
coverage is provided on materials, processes, and assembly 
methods, arranged primarily by function, with con-
siderable attention to in-process controls likely to affect 
reliability. Finally, attention is given to testing from the 
reliability demonstration point of view. 
Notes: 
1. Information concerning this innovation may be of 
interest to designers, manufacturers, and users of 
microcircuitry. 
Requests for further information may be directed to: 
Technology Utilization Officer 
Marshall Space Flight Center 
Code A&TS-TU 
Huntsville, Alabama 35812 
Reference: B72-10393 
Patent status: 
No patent action is contemplated by NASA. 
Source: W. D. McKee, Jr., J. E. Varga, J. V. Brandewie,

and A. P. Poole, Jr. of

North American Rockwell Corp.

under contract to

Marshall Space Flight Center 
(MFS-2 1964) 
ft	 Category 01 
Thisdocument was prepared underthe sponsorship of the National
	 Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States
	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States
	 will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19720000392 2020-03-17T03:37:16+00:00Z


Guidelines for fabrication of hybrid microcircuits

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