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Packaging concept for LSI beam lead integrated circuits
Authors
B. W. Kennedy
Publication date
1 July 1972
Publisher
Abstract
Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included
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oai:casi.ntrs.nasa.gov:1972000...
Last time updated on 31/05/2013