Technique joins titanium or one of its alloys to materials, such as iron, nickel or cobalt base material, or to refractory metals. To ensure formation of a satisfactory bond, the temperature, time, environment and pressure must be controlled

Kutchera, R. E.

English

NASA Technical Reports Server

December 1971
	 Brief 71-10525 
NASA TECH BRIEF 
Ames Research Center
	
-4:v 
NASA Tech Briefs announce new technology derived from the U.S. space program. They are issued to encourage 
commercial application. Tech Briefs are available on a aubscription basis from the National Technical Information 
Service, Springfield, Virginia 22151. Requests for individual copies or questions relating to the. Tech Brief program may 
be directed to the Technology Utilization Office, NASA, Code KT, Washington, D.C. 20546. 
Copper/Nickel Eutectic Brazing of Titanium 
Titanium or one of its alloys can be joined to an-
other material, such as iron, nickel, or cobalt base 
material and even to a refractory metal by use of 
diffusion-brazing techniques and a copper/nickel to 
titanium eutectic. 
The basic concept behind this approach is that 
if an eutectic can be formed between two pieces of 
titanium and a thin flint of an interlayer material, 
then another material can be substituted for one of 
the pieces of titanium, and the eutectic will still be 
formed through agency of the remaining titanium 
member. 
The film of joining material may be commercially 
pure copper or nickel, or an alloy containing up to 
3% foreign elements such as Cr, Mn, Al, Sn, Si, etc. 
It may be a Cu/Ni alloy such as Monel, Constantan, 
or an alloy containing up to 8% foreign elements as 
in "R-, K-, H-, or S-Monel." Film thickness may vary 
from 1 x 1O4 to 80 x 10 mm. Its placement may 
involve the use of various techniques such as chem-
ical plating, electroplating, vapor deposition, or met-
allizing; also any form of shims or foils may be 
preplaced.
In order to ensure a satisfactory bond, temperature, 
time, environment, and pressure must be controlled. 
The technique has been used to join 17-7 PH, 
17-4 PH and René 41 to Ti-6A1-4V using 13 X 10 mm 
copper as the interlayer material. 
Note: 
Requests for further information may be di-
rected to: 
Technology Utilization Officer 
Ames Research Center 
Moffett Field, California 94035 
Reference: TSP71 -10525 
Patent status: 
No patent action is contemplated by NASA. 
Source: Richard E. Kutchera of

General Electric Co.

under contract to

Ames Research Center 
(ARC-10337) 
Category 08 
This document was prepared under the sponsorship of the National
	 Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States
	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States
	 will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19710000517 2020-03-17T02:27:07+00:00Z


Copper/nickel eutectic brazing of titanium

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