Welding technique produces more reliable joints than soldering. Investigation used different sizes of copper conductors and component lead ribbons, corrosion protection platings, and melting points of metals being joined. Optimum combination is gold-plated component lead ribbons and solder-plated copper conductors

Mc Daniel, G. E.

English

NASA Technical Reports Server

June 1971
	 Brief 71-10168 
• NASA TECH BRIEF 
Marshall Space Flight Center 
NASA Tech Briefs announce new technology derived from the U.S. space program. They are issued to encourage 
commercial application. Tech Briefs are available on a subscription basis from the National Technical Information 
Service, Springfield, Virginia 22151. Requests for individual copies or questions relating to the. Tech Brief program may 
be directed to the Technology Utilization Office, NASA, Code KT, Washington, D.C. 20546. 
Parallel-Gap Welding for Joints Between Copper Conductors and Kovar 
An investigation into the feasibility of employing 
parallel-gap welding to produce joints between com-
ponent lead ribbons of Kovar (consisting of nickel, 
cobalt, and iron) and copper conductors showed that 
such a technique would produce more reliable joints 
than soldering. Soldering is the method most com-
monly used, but the joints formed often prove un-
reliable under extreme environmental conditions such 
as rapid ambient pressure changes, thermal expansion 
differentials, and severe shock and vibration forces. 
The investigation included evaluation tests using 
several different sizes of copper conductors and 
component lead ribbons. It also included different 
platings for corrosion protection, and for overcoming 
mismatches of the thermal and electrical conductivi-
ties and melting points of the metals being joined. 
One conclusion was that the success of the joint 
depends on the type of plating over the copper 
conductors and lead ribbons, but is not dependent 
on ribbon and copper sizes. The optimum combina-
tion was found to be gold-plated component lead 
ribbons and solder-plated (coated) copper conductors. 
Note: 
The following documentation may be obtained 
from:
National Technical Information Service 
Springfield, Virginia 22151 
Single document price $3.00 
(or microfiche $0.95) 
Reference: 
NASA-TN-D-6236, Parallel Gap Welding 
Kovar Ribbons to Copper Conductor Printed 
Wiring Boards 
Patent status: 
No patent action is contemplated by NASA. 
Source: G. E. McDaniel

Marshall Space Flight Center

(M FS-2 1224) 
Category 08 
This document was prepared under the sponsorship of the National
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Aeronautics and Space Administration. Neither the United States
	 information contained in this document, or warrants that such use 
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Parallel-gap welding for joints between copper conductors and Kovar

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