Integrated circuit modules can be compactly assembled into short-run complex electronic assemblies by mounting them on a Stick module. This module provides a method of high-density packaging for industrial operations that require the fabrication of compact circuitry configurations

Katzin, L.

English

NASA Technical Reports Server

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()cther 1969	 Brief 69-10498 
NASA TECH BRIEF	 G 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Folded Stick Module 
IC Flatpack 
Hinge Joints
Terminals For
Mounting Flatpacks 
Input-Output 
Terminals 
'A
	
Hinges 
Hinge Joints 
Figure 1. Folded Stick Module Open Configuration Figure 2. Folded Stick Module—Closed Configuration 
The problem: 
module packaging technique for use in industrial 
operations that require the fabrication and assembly 
of compact circuitry configurations, such as those 
used in the central processing units of computers. 
	
To develop a high-density integrated circuit (IC)
	
opposite face to which interconnections can be made 
to terminal. 
a similar one of higher density, which consists of 
two sections molded of polypropylene plastic, known 
as the "Folded Stick" module. This module provides 
between IC flatpacks by running wires from terminal 
A logical extension of this original Stick module is 
The solution:	 a method of high-density packaging for industrial 
	
IC modules can now be compactly assembled into 	 operations that require the fabrication and assembly 
	
short-run complex electronic assemblies by mount-	 of physically compact circuitry configurations. The 
	
ing them on a "Stick" module. This module is an 	 Folded Stick module has integral flexible hinges ex- 
	
elongated flat member with terminals on one face to	 tending longitudinally along the two sections joining 
	
hich leads of IC flatpacks can be mounted, and an 	 them together so that they can be folded upon one 
(continued overleaf)
NNW
This document was prepared under the sponsorship of the National 
Aeronautics and Space Administration. Neither the United States 
Government nor any person acting on behalf of the United States
Government assumes any liability resulting from the use of the 
information contained in this document, or warrants that such use 
will be free from privately owned rights.
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another. The folded-over sections are held in place by 
a clasping arrangement consisting of integrally molded 
mating male and female protrusions along opposite 
edges of the sections. In the unfolded position insu-
lated magnet wire interconnections can be made as 
on the original Stick module by welding from termi-
nal to terminal on the inner plane of each of the sec-
tions; in addition, interconnections can be made be-
tween terminals on both sections. When the sections 
are folded, the interconnections are completely 
hidden within the module. Flatpack IC modules sub-
sequently soldered by their leads to the web terminals 
on the outside planes of the sections can be re-
placed without disturbing the hidden interconnec-
tions. 
How it's done: 
The IC modules are located on a foldable flat lay-
out making it possible to separate the attachment 
terminals and the IC interconnections. This invention 
provides a method of high density IC module packag-
ing. The Folded Stick module in an open configura-
tion with wire interconnections completed is shown 
in figure 1. It is shown in a closed configuration with 
the clasping members engaged with the wire connec-
tions hidden within the module in figure 2. A manu-
facturing drawing of the module is given in figure 3. 
The advantages of using the Folded Stock module 
include the following: the wiring is protected within 
the fold forming a self-contained mold in which the 
wiring can be encapsulated; the component density of 
a system is improved, a density of thirty 14-lead IC's
per cubic inch being possible with relatively little 
density being lost in the subsystem for packaging; 
a very simple back panel can be used to combine many 
of these modules into the electronic system; only a 
one-sided printed circuit board is needed; and the 
total number of terminals required for the complete 
electronic system can be reduced as a result of the 
number of interconnections that can be made between 
the two sections, thus improving reliability. 
Notes: 
1. This invention could be of interest to designers 
and manufacturers of computer hardware and 
mobile communication equipment. 
2. No additional documentation is available for this 
Tech Brief. 
3. Questions concerning this invention may be di-
rected to:
	 - 
Technology Utilization Officer 
NASA Pasadena Office 
Pasadena, California 91103 
Reference: B69-10498 
Patent status: 
Inquiries about obtaining rights for the commercial 
use of this invention may be made to NASA, Code 
GP, Washington, D.C. 20546 
Source: Leonard Katzin of

Caltech/JPL
under contract to

NASA Pasadena Office

(N P0-10854)
. 
. 
Dimensions and Method of Fastening Optional.	 II 
Fabricate to Permit 90* Bend Per Mfg. Process. 
Notes: Unless Otherwise Specified
	 P01000 POSITION 
Figure 3. Folded Stick Module - Manufacturing Drawing S 
Brief 69-10498	 Category 01 


Folded stick module

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