Tool bends leads quickly and accurately for mounting on printed circuit boards. It has grooves and bend-angles aligned for particular circuit board applications

Koster, C. H.

English

NASA Technical Reports Server

July 1970	 Brief 70-10117 
.
	
NASA TECH BRIEF 
NASA Tech Briefs announce new technology derived from the U.S. space program. They are issued to encourage commercial 
application. Tech Briefs are available on a subscription basis from the Clearinghouse for Federal Scientific and Technical 
Information, Springfield, Virginia 22151. Requests for individual copies or questions relating to the Tech Brief program may 
be directed to the Technology Utilization Division, NASA, Code UT, Washington, D.C. 20546. 
Integrated Circuit Flat-Pack Lead Bender 
S
The problem: 
To provide a means of bending integrated circuit 
flat-pack leads quickly and accurately for mounting 
on printed circuit boards so as to achieve high 
Part B - Flat-Pack Holder Cap 
Integrated Circuit Fiat-Pat

Part A - Flat-Pack Holder
Part C - Cor 
Integrated Circuit Flat-Pack Lead Bender 
density packaging with minimum damage to the flat-
packs. The present method requires manual bending 
of the leads to precise angles for fitting into mounting 
holes in printed circuit boards. The process is very 
time consuming and damage to the flat-pack fre-
quently occurs. 
The solution: 
A device (see fig.) in which an integrated circuit 
flat-pack can be mounted and held firmly while the 
leads are bent accurately, and without damage, to the 
necessary precise angles.
How it's done: 
The integrated circuit flat-pack is placed on the 
flat-pack holder (Part A), and the leads are aligned in 
the grooves of the holder. The pins of the flat-pack 
holder cap (Part B) are aligned with the holder and the 
two parts are brought together to hold the integrated 
circuit flat-pack firmly in place. The leads of the inte-
grated circuit flat-pack, which are sticking out at right 
angles from the holder, are initially bent down into 
the flat-pack holder grooves (Part A) using one's fin-
ger. The final bending is done by inserting the lugs of 
the comb (Part C) into the flat-pack holder grooves 
and combing downward over the flat-pack leads, thus 
making the precise required bend. The same proce-
dure is then repeated on the opposite set of flat-pack 
leads. 
Notes: 
1. The present tool is produced with grooves and bend-
angles aligned for particular circuit board applica-
tions. Different board mounting-hole configura-
tions require matching lead-bender grooves. 
2. Requests for further information may be directed to: 
Technology Utilization Officer 
Manned Spacecraft Center, Code BM7 
Houston, Texas 77058 
Reference: TSP70- 10117 
Patent status: 
No patent action is contemplated by NASA. 
Source: C. H. Koster of
Lockheed Electronics Company 
under contract to
Manned Spacecraft Center 
(MSC-13489) 
Category 01 
This document was prepared under the sponsorship of the National 
Aeronautics and Space Administration. Neither the United States 
Government nor any person acting on behalf of the United States
Government assumes any liability resulting from the use of the 
information contained in this document, or warrants that such use 
will be free from privately ownedrights.
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Integrated circuit flat-pack lead bender

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