Polymer adhesive laminates polyimide-film flat conductor cable. It is obtained by reacting an appropriate diamine with a dianhydride. The adhesive has also been used in the lamination of copper to copper for the preparation of multilayer circuit boards

Montermoso, J. C.

Saxton, T. R.

Taylor, R. L.

English

NASA Technical Reports Server

November 1967	 Brief 67-10429 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151.. 
Adhesives for Laminating Polyimide Insulated Flat Conductor Cable 
The problem: 
To develop an effective adhesive for laminating 
polyimide-film flat conductor cable. The adhesive 
must be capable of bonding polyimide film to poly-
imide film as well as to copper. It must remain ther-
mally stable over the operating range of the polyimide 
film and meet other rigorous physical and chemical 
requirements. This film is a commercially available 
plastic which has found extensive use as electrical 
coaxial cable insulation at temperatures of up to at 
least 3001 C. The wrapping techniques used for coaxial 
cable are unsuitable for flat strip conductors. 
The solution: 
A polymer, designated ODA/BTDA, which is ob-
tained by reacting an appropriate diamine with a 
dianhydride. The polymer is a polyimide having the 
following formula: Poly [N-(4,4'-diphenylether)4,4'-
carbonyldiphthalimide]. A comparable polyimide, 
designated MDA/BTDA, is obtained by replacing the 
oxygen linkage in the diphenylether group with the 
methylene linkage. These chemical structures provide 
adequate flow characteristics for lamination process-
ing, without appreciably decreasing Ihe thermal sta-
bility of the adhesive below that of the polyimide-
film insulation. 
How it's done: 
The polymers are prepared by a condensation reac-
tion between the diamine and dianhydride in a suitable
solvent. For example, the ODA/BTDA is obtained by 
refluxing 4,4'-diaminophenylether and benzophenone 
3, 4-3,4'-tetracarboxylic dianhydride in N,N'-di-
methylacetamide as a solvent. 
Notes: 
1. Permanent homogeneous polyimide-film flat 
conductor cables were laminated in 5- to 10-foot 
lengths using the new polyimide adhesive on a 
laboratory scale. Equipment for a continuous 
production-scale lamination process was not de-
veloped in this project. 
2. The adhesive has also been used in the lamina-
tidn of copper to copper for the preparation of 
multilayer circuit boards. The process has been 
satisfactorily developed using flat presses for 
laminates as large as 8x 10 inches. 
Patent status: 
Title to this invention has been waived under the 
provisions of the National Aeronautics and Space 
Act [42 U.S.C. 2457 (f)], to Quantum, Inc., Lufbery 
Avenue, Wallingford, Connecticut. 
Source: J. C. Montermoso, R. L. Taylor, 
and T. R. Saxton
of Quantum, Inc.
under contract to 
Marshall Space Flight Center 
(M FS- 12066) 
Category 03 
This document was prepared under the sponsorship of the National 
Aeronautics and Space Administration. Neither the United States 
Government nor any person acting on behalf of the United States
Government assumes any liability resulting from the use of the 
information contained in this document, or warrants that such use 
will be free from privately owned rights.
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Adhesives for laminating polyimide insulated flat conductor cable

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