Computer program solves transient or steady-state heat flow problems through the concept of lumped parameters expressed as the electrical analog of the heat transfer problem using finite differences techniques

Sakakura, H. D.

English

NASA Technical Reports Server

July 1969
	
Brief 69-10239 
•
ICY V
AEC-NASA TECH BRIEF 
AEC-NASA Tech Briefs describe innovations resulting from the research and development program 
of the U.S. AEC or from AEC-NASA interagency efforts. They are issued to encourage commercial 
application. Tech Briefs are published by NASA and may be purchased, at 15 cents each, from 
the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Thermal Network Analyzer Program 
The problem: 
To produce a one, two, or three-dimensional tem-
perature distribution in any solid body subject to con-
vective, radiation or adiabatic boundary conditions 
with provision for heating from internal heat genera-
tion. There should also be a capability of transient 
or steady-state solutions. 
The solution: 
This program solves transient or steady-state heat 
flow problems through the concept of lumped parame-
ters expressed as the electrical analog of the heat 
transfer problem using finite differences techniques. 
How it's done: 
The Thermal Network Analyzer Program solves n-
dimensional transient heat flow problems through 
the use of an electrical analog of the thermal network 
expressing the heat flow problem to be solved. 
The vast majority of heat flow problems may, by 
lumping the physical parameters, be represented by 
a thermal resistance-thermal capacitance network 
with the capability of heat input at any of the dis-
crete "nodes" in the network. 
The user generates a one, two, or three-dimensional 
network mesh with the nodal points at the centroid of 
each element of the mesh. Prior to input, it is neces-
sary to compute thermal resistances between nodes 
and thermal capacitance, for the transient solution, 
based on an initial estimate of temperature. 
The program will accept tables of variable thermal 
conductivity and specific heat as a function of tem-
perature and modifies resistances and capacitances 
in successive iterations. 
Notes: 
I. The program is limited to 400 nodal points and 700 
resistors. 
2. This program is written in FORTRAN IV language 
for use on the IBM-7094 computer. 
3. Inquiries should be made to: 
COSMIC 
Computer Center 
University of Georgia 
Athens, Georgia 30601 
Reference: B69-10239 
Patent status:-	 - 
No patent action is contemplated by NASA. 
Source: H. D. Sakakura of 
Aerojet-General Corporation 
under contract to 
AEC-NASA Space Nuclear Propulsion Office 
(NUC- 10540) 
Category 06 
This document was prepared under the sponsorship of the Atomic 
Energy Commission and/or the National Aeronautics and Space 
Administration. Neither the United States Government nor any per-
son acting on behalf of the United States Government assumes any
liability resulting from the use of the information contained in this 
document, or warrants that the use of any information, apparatus, 
method, or process disclosed in this document may not infringe pri-
vately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19690000239 2020-03-16T17:45:20+00:00Z


Thermal Network Analyzer Program

Abstract

Similar works

Full text

Available Versions

NASA Technical Reports Server