Abrasive jet technique, producing prototype conductor networks for thick-film hybrid microcircuits, does not require screening and fixing procedures. Pantograph engraver is used to perform abrasive cutting of the conductor network

Nugent, J. B.

Palermo, J. S.

English

NASA Technical Reports Server

August 1969	 Brief 69-10235 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Technique for Abrasive Cutting of Thick-Film Conductors

for Hybrid Circuits 
is
The problem: 
Fabricating microcircuit prototypes in the laboratory 
without requiring screening and fixing procedures. 
The solution: 
An abrasive jet technique used to produce prototype 
conductor networks for thick-film hybrid microcircuits. 
This technique uses a pantograph engraver to perform 
abrasive cutting of the conductor network. 
How it's done: 
The abrasive cutting operation is performed by 
adapting the nozzle of a thick-film resistor trimmer 
to the spindle of a pantograph. Cutting parameters 
are 80-psi pressure, a nozzle tip distance of approxi-
mately 0.015-inch and a powder flow of about 10 
grams per minute. Cutting time for each network is 
less than 20 minutes. 
A cleaning process is necessary to remove all traces 
of the powder before assembly. It is recommended 
that tweezers be used when handling the units. Sub-
sequent to ultrasonic cleaning the components are 
bonded to the substrate and the wire interconnections 
are made by conventional methods. The final operation 
before testing is trimming of the resistor chips. 
The estimated cost of this facility is less than 
$15,000; equipment required includes: a pantograph, 
a thick-film resistor trimmer, and a chip-and-wire 
bonder. A conventional facility set-up for producing 
hybrid thick-film microcircuits would cost in excess
of $50,000. 
Notes: 
1. The technique described in this NASA Tech Brief 
is unique in that it is used to fabricate microcircuit 
prototypes. The value of this technique is that it 
permits laboratory fabrication of prototype de-
signs without screening and fixing procedures. The 
process discussed should be of interest to individ-
uals associated with electronic laboratories, elec-
tronic design, and microcircuit research. 
2. There remain many areas of investigation, e.g., 
crossover capability, optimum bonding methods, 
protective coatings, etc., before the abrasive circuit 
process can be thoroughly evaluated. 
3. Documentation is available from: 
Clearinghouse for Federal Scientific 
and Technical Information 
Springfield, Virginia 22151 
Price $3.00 
Reference: TSP69- 10235 
Patent status: 
No patent action is contemplated by NASA. 
Source: John B. Nugent and Joseph S. Palermo of 
The Massachusetts Institute of Technology 
under contract to 
Manned Spacecraft Center 
(MSC-13242) 
Category 03 
This document was prepared under the sponsorship of the National	 Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States
	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States	 will be free from privately owned rights.
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Technique for abrasive cutting of thick-film conductors for hybrid circuits

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