Process reduces secondary electron emission in coaxial connector and in waveguides in the atmosphere. The assembly is placed in a vacuum chamber and is gradually vented to the atmosphere. It is exposed to high voltage, argon gas, and a hydrocarbon gas during the process

Erpenbach, H.

English

NASA Technical Reports Server

December 1966
	
Brief 66-10685 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Process Reduces Secondary Resonant Emission in Electronic Components 
Copper Shield
	
Copper Table 
The problem: 
The requirement to significantly increase the power 
output of transmitters used on interplanetary probes 
has stimulated research into methods of reducing sec-
ondary electron emission (multipaction) in coaxial 
connectors and in waveguides. Unpressurized rf sys-
tems are desirable because equipment is less complex 
and lighter in weight and because of the danger of 
pressure loss that can result in system failure where 
such a system of multipaction prevention is used. The 
technique of coating with titanium reduces multipac-
tion in vacuum but does not appreciably affect it 
after exposure to the atmosphere.
The solution: 
After the assembly to be treated has been cleaned 
of all contaminants, it is placed in a vacuum chamber 
and the negative lead of a high voltage supply 
(nominally 5 kv) is applied to the assembly while 
the positive lead is applied to ground. The chamber 
is now evacuated to approximately 10- 6 torr and 
argon gas is introduced into the chamber until the 
assembly glows evenly. The argon feed is terminated 
and a hydrocarbon gas such as methane is introduced 
which disassociates in the discharge to form a thin 
carbon film causing the glow to disappear after about 
one minute, at which time the high voltage is re-
moved and the chamber is vented to the atmosphere. 
(continued overleaf) 
This document was prepared under the sponsorship of the National 
Aeronautics and Space Administration. Neither the United States 
Government nor any person acting on behalf of the United States
Government assumes any liability resulting from the use of the 
information contained in this document, or warrants that such use 
will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19660000683 2020-03-11T17:42:49+00:00Z
Notes: 
1. Apparatus required for this process is standard 
except for the water cooled etching table whose 
teflon insulated bearing permits the high voltage 
application. 
2. Inquiries concerning this innovation may be di-
rected to: 
Technology Utilization Officer 
Jet Propulsion Laboratory 
4800 Oak Grove Drive 
Pasadena, California 91103 
Reference: B66-1 0685
Patent status: 
No patent action is contemplated by NASA. 
Source: H. Erpenbach 
(JPL-934) 
Brief 66-10685	 Category 01


Process reduces secondary resonant emission in electronic components

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