Heat-load simulator is fabricated from 1/4-inch aluminum plate with a contact surface equal in dimensions and configuration to those of the electronic installation. The method controls thermal output to simulate actual electronic component thermal output

Dunleavy, A. M.

Vaughn, T. J.

English

NASA Technical Reports Server

\o\eillher 1968
	 Brief 68- 10510 
NASA TECH BRIEF
Ct" 
- 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Heat-Load Simulator for Heat Sink Design 
In the design of heat dissipating surfaces (heat 
sinks) for mounting heat generating electronics 
equipment, actual loading of the developmental 
heat sink with equipment design loads is a re-
quirement. To operate complex, sophisticated, and 
expensive electronic gear merely for the purpose 
of designing heat dissipative mounts, is a poor 
approach to the problem from an economic as 
well as a time scheduling point of view. Because 
manufacturers rate components as to thermal out-
put, simulated heat loading could be substituted
for actual component loading if close thermal 
output is assured. 
A method has been found that provides a 
closely controlled thermal output to simulate 
actual electronic component thermal output in 
whatever configuration the actual installation will 
assume. The heat-load simulator is fabricated 
from 1/4-inch aluminum plate with a contact sur-
face equal in dimensions and configuration to 
those of the electronic installation. On the oppo-
site side of the plate thermocouple wire insulated 
S
(conhin ned o' erleali 
I his document was prepared under the sponsorship of the National
	 Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States
	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States
	 will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19680000466 2020-03-12T06:03:10+00:00Z
with glass fibers is arranged in a series of pat-
terns and in sufficient depth to reproduce the 
thermal inputs to the mount that the final instal-
lation components would present. The above 
figure is an example of such a heat-load simula-
tor designed in accordance with the thermal map 
shown below. 
No-tes: 
I. This innovation would make an excellent lab-
oratory tool wherever cost and scheduling 
prohibits the use of actual electronic equip-
ment.
2. Documentation for the innovation is available from: 
Clearinghouse for Federal Scientific 
and Technical Information 
Springfield, Virginia 22151 
Price $3.00 
Reference: B68-10510 
Patent status: 
No patent action is contemplated by NASA.

Source: Ann M. Dunleavy
and Thomas J. Vaughn 
of North American Rockwell Corporation

under contract to
Manned Spacecraft Center 
(MSC-15170) 
Brief 68-10510
	 Category 02


Heat-load simulator for heat sink design

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