In tinning transistor leads, an aluminum jig is used to dip the leads into the molten tin. The jigs mass shunts excess heat given off by the molten tin before it reaches and damages the transistor body

Pelletier, A. J.

Willis, G. A.

English

NASA Technical Reports Server

June 1966	 Brief 66-10240 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U. S. space 
program and to encourage their commercial application. Copies are available to the public from 
the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Jig Protects Transistors from Heat While Tinning Leads 
) 
Knurled Disk_
Sleeve 
The problem: 
In tinning transistor leads, heat from the molten 
tin must be dissipated before it reaches and damages 
the transistor body. Previous methods involving hand 
dipping the leads one at a time, with an alligator clip 
on the lead to provide a heat sink, are too time con-
suming and produce nonuniform tinning.
The solution: 
An aluminum fixture, used to dip all transistor 
leads at the same time and whose mass shunts excess 
heat from the transistor body. 
How it's done: 
The fixture is in two halves with a tang on an end 
of one sandwiched between an upper and lower tang 
(continued overleaf) 
AdL
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on an end of the other. A pin within a sleeve that 
is press fit into the upper tang, engages the interior 
tang by a spline arrangement and is fitted with a 
knurled disk at the other end. The ends opposite the 
tangs are held together and machined to form three 
small through-holes for the leads plus a circular 
recess to receive the transistor body. 
With the transistor resting in one of the semicircu-
lar recesses and the leads resting in the through holes, 
the knurled disk is turned counterclockwise to close 
the two halves about the transistor body and leads 
as the jig is held by the sleeve. The leads extending 
below the jig are dipped in the molten tin and any 
heat trying to reach the transistor body is absorbed 
by the mass of the jig.
Note: 
Inquiries concerning this innovation may be di-
rected to:
Technology Utilization Officer 
Manned Spacecraft Center 
Houston, Texas, 77058 
Reference: B66-10240 
Patent status: 
No patent action is contemplated by NASA. 
Source: A. J. Pelletier and G. A. Willis 
of North American Aviation, Inc. 
under contract to 
Manned Spacecraft Center 
(MSC-515) 
Brief 66-10240	 Category 05


Jig protects transistors from heat while tinning leads

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