Adhesive cured at room temperature provides an effective adhesive bond over the range from room temperature down to the temperature of liquid hydrogen. The adhesive consists of one part of 200-mesh powdered nylon filler to two parts of an epoxy-polyamine resin

Klinger, H. J.

Smith, M. B.

English

NASA Technical Reports Server

May 1966
	 Brief 66-10185 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U. S. space 
program and to encourage their commercial application. Copies are available to the public from 
the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
proved Adhesive for Cryogenic Applications Cures at Room Temperature 
The problem: 
To formulate an adhesive that will cure at room 
temperature and provide an effective adhesive bond 
over the range from room temperature down to the 
temperature of liquid hydrogen (-423° F). 
The solution: 
An adhesive consisting of I part of 200-mesh 
powdered nylon filler to 2 parts of an epoxy-polya-
mine resin. 
The added nylon filler markedly improves the ad-
hesive strength (tensile shear) and adhesive toughness 
(1-peel strength) of the epoxy-polyamine resin. The 
filled adhesive can be cured at room temperature, 
whereas the unfilled resin requires a 250° F curing 
cycle. When applied to 7075-16 bare aluminum, the 
bond strengths of the filled and unfilled adhesives 
cured under contact pressure at room temperature are 
as follows:
--  
Adhesive	
Tensile Shear (Psi)	 T-Peel (Lb/in.) 
R. Temp. -320F -423F Rn, Temp. -320'F -423F 
Unfilled 
Epoxy-Polyamine	 2334 1514 1552	 0	 0	 0 
Nylon-Filled 
Epoxy-Polyamine	 3127 2710 2552	 3.9	 3.5	 3.0 
Note: 
Inquiries concerning this innovation may be di-
rected to:
Technology Utilization Officer 
Western Operations Office 
150 Pico Boulevard 
Santa Monica, California, 90406 
Reference: B66-10185 
Patent status: 
No patent action is contemplated by NASA. 
Source: M. B. Smith and Harry J. Klinger 
of Telecomputing Corporation 
under contract to
Western Operations Office
(WOO- 132) 
Category 03 
This document was prepared under the sponsorship of the National 	 Government assumes any liability resulting from the use of the 
Aeronautics and Space Administration. Neither the United States 	 information contained in this document, or warrants that such use 
Government nor any person acting on behalf of the United States	 will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19660000184 2020-03-11T17:30:26+00:00Z
pe


Improved adhesive for cryogenic applications cures at room temperature

Abstract

Similar works

Full text

Available Versions

NASA Technical Reports Server