Cryogenic stripping of Teflon insulated wire leaves no residue and produces no physical damage. After the wire is immersed in liquid nitrogen, bent slightly, and returned to room temperature, the Teflon is removed by fingernails or flat-nosed pliers

Babb, B. D.

English

NASA Technical Reports Server

March 1967	 Brief 67-10048 
NASA TECH BRIEF 
NASA Tech Briefs are issued to summarize specific innovations derived from the U.S. space program, 
to encourage their commercial application. Copies are available to the public at 15 cents each 
from the Clearinghouse for Federal Scientific and Technical Information, Springfield, Virginia 22151. 
Technique for Stripping Teflon Insulated Wire 
The problem: 
To avoid unreliable solder connections with Teflon 
insulated wire, it is mandatory that the insulation be 
stripped without leaving a residue or producing physi-
cal damage. Mechanical stripping generally produces 
some physical damage to the wires; thermal stripping 
leaves a small residue which makes it difficult to 
achieve reliable solder connections 
The solution: 
A process for the cryogenic stripping of Teflon 
insulation using liquid nitrogen. 
How it's done: 
A number of Teflon insulated wire samples are im- 
mersed about 5 cm into a container of liquid nitrogen. 
When boiloff ceases, the wires are withdrawn singly 
and bent slightly, first in one direction and then the 
opposite. This bending action causes the highly frangi-
ble Teflon coating to fracture at the flex point. Later, 
when the wire returns to room temperature, the Teflon 
insulation is easily removed by sliding it off with the 
fingernails or flat-nosed pliers.
Notes: 
1. Although the fingernail method is hardly practica-
ble, except for limited application, it serves to 
illustrate the potential. The basic technique has 
been successfully tested and a mechanized device is 
now under construction. 
2. Inquiries concerning this invention may be directed 
to:
Technology Utilization Officer 
Marshall Space Flight Center 
Huntsville, Alabama 35812 
Reference: B67-10048 
Patent status:	 - 
Inquiries about obtaining rights for the commercial 
use of this invention may be made to NASA, Code 
GP, Washington, D.C. 20546.
Source: B. D. Babb
of Hayes International Corporation
under contract to

Marshall Space Flight Center
(M-FS- 1774) 
Category 05 
This document was prepared under the sponsorship of the National 
Aeronautics and Space Administration. Neither the United States 
Government nor any person acting on behalf of the United States
Government assumes any liability resulting from the use of the 
information contained in this document, or warrants that such use 
will be free from privately owned rights.
https://ntrs.nasa.gov/search.jsp?R=19670000048 2020-03-11T20:22:56+00:00Z


Technique for stripping Teflon insulated wire

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