CORE
🇺🇦
make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
高密度DNA微阵列生物芯片的制作方法
Authors
于 军
任鲁风
+4 more
余金中
俞育德
李运涛
胡 迪
Publication date
12 August 2010
Publisher
Abstract
一种高密度DNA微阵列生物芯片的制作方法,其特征在于,包括如下步骤:步骤1:在铝或铝合金薄膜表面采用阳极氧化方法制作高密度多孔氧化铝模板;步骤2:将多孔氧化铝模板从铝或铝合金薄膜表面上剥离;步骤3:将多孔氧化铝模板转移至DNA微阵列生物芯片基片表面,作为DNA微阵列生物芯片基片的刻蚀掩膜;步骤4:采用刻蚀的方法对DNA微阵列生物芯片基片进行刻蚀;步骤5:移除多孔氧化铝模板,完成高密度DNA微阵列生物芯片的制作。本发明其具有密度高、成本低、操作简单、适于大规模工业化制作的优点
Similar works
Full text
Available Versions
Knowledge Repository of SEMI,CAS
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:ir.semi.ac.cn:172111/13462
Last time updated on 15/03/2019