CHOI, CHANGYU

Ho-Jin Song

JEONG, HYUNHAK

We present a THz waveguide packaging technique with which a single chip can be coupled to multiple waveguide interfaces using multiple on-chip probes. This technique could provide simple assembly and an LO/IF signal distribution circuit in a THz beamforming module and low loss power combining. For experimental demonstration, two 50 �� CPWs were integrated on a 50-um thick InP substrate along with four dipole waveguide couplers and coupled to output waveguides ports with the WR3.4 split-block module technique. All on-chip transitions provided flat insertion loss and return loss of less than-10 dB. The estimated transition loss per dipole antenna is around 1 dB. The inter-circuit isolation between CPWs was 40 dB or better from 240 to 320 GHz. For the open CPW, intra-circuit and inter-circuit isolations were also measured to be 40 dB or more in 240 320 GHz as well. ? 2021 IEEE.1

THz-Wave Waveguide Packaging with Multiple THz On-Chip Transitions Integrated in Single Chip

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