This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the Makedonia Palace Hotel, Thessaloniki in Greece. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, Aristotle University of Thessaloniki, University of Thessaly, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute.The high heat transfer coefficients in microchannels are attractive for direct cooling of electronic systems requiring high heat-flux removal. In this work we are presenting the results of a study on self-similar heat sinks for liquid cooled electronics, made from copper, designed for industrial application and for large scale production. The internal structures, where the most part of the active cooling takes place, have been designed in order to achieve high heat transfer coefficients. As it is almost impossible to validate the design and describe the flow characteristics inside the device via analytical solutions, a well known numerical code was employed to have an insight of the thermal-fluid
distributions. It is clear from the simulation that even if copper is characterized by a high thermal conductivity, most of the heat is removed in the overflow-structure, on the side of the device adjacent to the source of heat. This paper attempts to critically analyse a comprehensive list of data as well as plots in order to illustrate the significant characteristics of this type of device
