Breadboard model development of integrated static inverte

Glover, L. L.

Hahn, L. A.

Newcomb, P. F.

Vergez, J. P.

English

NASA Technical Reports Server

. 
DESIGN, DEVELOPMENT AND DELIVERY OF 
ObfE (1) BReADBOARD AND T W E  (3)  PRODUCTION 
U S I T S  OF A 75 VA INTEGRATED STATIC INVERTER 
HONTHLk’ REPORT NUMBER 11 
MARCH 1966 
J. P. V e r g e z  
L. A. Hahn 
L. L. G l o v e r  
P .  E’. Newcomb 
C o n t r a c t  Nuniber NAS 8-11925 
Cnntrol Number DCN 1-5-40-56195 (IF’) & SI ( I F )  
I I  
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Prepared by 
TEXAS INSTRUMENTS INCORPORATED 
D S e m i c o n d u c t o r - C o m p o n e n t s  D i v i s i o n  D C  ” P o s t  O f f i c e  B o x  5012 
E 2 Q  O  D a l l a s ,  T e x a s  75222 
s a = -  
x r ; :  (0 .- 
D, / For 
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NATIONAL AERONAUTICS AND SPACE ADMINISTRATION 
George C. Marshall Space F l i g h t  C e n t e r  
Huntsville,  A l a b a m a  35812 
https://ntrs.nasa.gov/search.jsp?R=19660023466 2020-03-16T21:00:48+00:00Z
t . 
b 
SECTION I1 
TECHNICAL DISCUSSION 
A. Proqress  R e p o r t  f o r  Month of March, 1966 
1. Summary 
Ficp res  1, 2, 3 and  le 1. ( a l l  h r a t e d  in t he  +pendix) 
a r e  updated ve r s ions  of the  s a m e  f i g u r e s  and tables sub- 
m i t t e d  i n  t h e  "Detai led Subassenibly Design Report" sub- 
mi t ted  l a s t  month. Any s i g n i f i c a n t  dev ia t ion  from t h a t  
Subassembly Design Report w i l l  be repor ted  i n  an appendix 
t o  t h e  monthly report as i s  b e i n g  done t h i s  month. 
Severa l  minor c i r c u i t  modif icat ions w e r e  made t o  t h e  
breadboard t o  improve performance a t  t h e  temperature ex- 
t r e m e s .  
The v a r i a b l e  duty  c y c l e  one-shots wi th  gold l ead  p a t t e r n  
w e r e  slice probed, canned and tested e l e c t r i c a l l y .  
Construct ion has  begun on t h e  breadboard t o  be shipped t o  
Huntsv i l le .  
System packaging d e t a i l s  have been r e c e i v i n g  cons ide ra t ion ,  
p a r t i c u l a r l y  t h e  p o t t i n g  of the induc to r s .  
Operating + 10, + 12, and Ripple Counter a r r a y s  have been 
f a b r i c a t e d .  The f i r s t  l o t  of Johnson Counter m a t e r i a l  has  
been eva lua ted  i n  slice form. Severa l  a r r a y s  i n d i c a t e d  
proper  opera t ion :  t h e s e  a r r a y s  are be ing  mounted i n  pack- 
ages for  f u r t h e r  e l e c t r i c a l  and mechanical eva lua t ion .  
. 
2. 
I 
Report ?:o. 03-Gli-37 I1 - 2 
j 
S u f f i c i e n t  materiai  has been processed  thrcugh t h e  re- 
qu i r ed  d i f f u s i o n s  t o  s a t i s f y  t h e  t o t a l  requirement of t h i s  
program. T h i s  mater ia l  is c u r r e n t l y  be ing  probed and 
assembled. 
Fabr i ca t ion  of the  d u a l  power dev ices  has  been delayed 
by the problem of cap ceramic f r a c t u r e  du r ing  co ld  weld. 
A l t e r n a t i v e  fabrication techniques  are now be ing  eva l -  
ua ted .  
Proqress  R e p o r t  on Subsect ions 
a. I n v e r t e r  Breadboard 
I n  t h e  Appendix is  shown t h e  b lock  diagram (Figure  1) 
and t h e  system schematic (F igure  2 )  as t h e  i n v e r t e r  
w i l l  be when it is completed. A d i f f e r e n c e  exists 
between schematics  Figure 1 of t h e  tex t  and Figure  2 
of t h e  Appendix only  i n  the f i n a l i z e d  components and 
packages. What we  do have a t  p r e s e n t  i s  shown i n  
F igure  1. 
The e f f i c i e n c y  of t h i s  breadboard f o r  28 v o l t s  i n p u t  
and 100% r a t e d  load  output  i s  65%. 
Temperature tes ts  have been run and have r e s u l t e d  i n  
s e v e r a l  modi f ica t ions ;  p r i m a r i l y  the a d d i t i o n  of s ta-  
b i s t o r  s f o r  temper a t u r  e compensation. 
(1) V a r i a b l e  Duty Cy cle One-Shot 
Af t e r  t e s t i n g  the  new gold lead  p a t t e r n  v a r i a b l e  
duty  cycle one-shots (L-169's) a t  e l e v a t e d  tem- 
pera ture ,  it was decided  no t  t o  use  t h e  i n t e r n a l  
d iode  between p ins  1 and 2 (See Figure  3 of 
Appendix) s ince  better performance could  be 
obta ined  us ing  a d i s c r e t e  diode.  
Report No. 03-66-37 
I I. I C .  
II-2a 
Report Yo. 03-(4-37 I1 - 3 
(2) Pot t inq  Compound 
A dec i s ion  was made t o  u s e  Emerson & Cumings 
Stycase 1090 w i t h  C a t a l y s t  11 a s  t h e  p o t t i n g  
compound for  t h e  induc to r s  and s o m e  c a p a c i t o r s  
(See Figure 2 of Appendix). A sample t r a n s -  
former, handling t h e  power equ iva len t  t o  150% 
rated load f o r  one t ransformer,  had i t s  i n t e r -  
n a l  temperature checked w i t h  a thermocouple 
b u r i e d  i n  t h e  primary winding. The po t t ed  
t ransformer showed only a 10°C i n c r e a s e  i n  
i n t e r n a l  temperature over the  temperature of 
the  unpotted t ransformer.  
( 3 )  F i n a l  I n v e r t e r  Breadboard 
Construct ion has begun on t h e  breadboard t o  
be shipped t o  Huntsv i l le .  An e f for t  i s  b e i n g  
made t o  make the  placement of t h e  components 
i n  t h i s  breadboard very s i m i l a r  t o  t he  com- 
ponent placement v i s u a l i z e d  f o r  t h e  f i n a l  
packages. This should be a great h e l p  i n  
b r i n g i n g  t o  l i g h t  any d i f f i c u l t i e s  w h i c h  
might occur la ter  because of wir ing ,  cross 
t a l k ,  etc.  
b. Fl ip-Flop Arrays 
The metal l izat ion and c o n t a c t  masks for t h e  Johnson 
Counter w e r e  processed. The computer program used 
for t h e  m e t a l l i z a t i o n  p a t t e r n  was m o s t  s a t i s f a c t o r y .  
This  i s  a s i g n i f i c a n t  accomplishment. 
S i l i c o n  slices f o r  both t h e  Ripple Counter a r r a y  types 
and t h e  Johnson Counter a r r a y s  are i n  t h e  f i n a l  stages 
of d i f f u s i o n  processing. Packaged and t e s t e d  u n i t s  of 
I1 - 4 
a l l  t h r e e  of t h e  Ripple Counter a r r a y  types  (+ 10, 12, 
f 256) have been f ab r i ca t ed .  Addi t iona i  u n i t s  a r e  be ing  
t e s t e d .  The f i r s t  l o t  of Johnson Counter a r r a y s  has  been 
probed, and i s  be ing  assembled prior t o  encapsula t ion  
and f i n a l  test. Addit ional  l o t s  of material are be ing  
readied  for s l ice  probing .  
Thermal r e s i s t a n c e  experiments on t h e  16-pin i n t e g r a t e d  
c i r c u i t  package have been compieted. ijata ars presently 
being  t abu la t ed .  This package, us ing  a l l o y i n g  as t h e  
technique for mounting the s i l i c o n  b a r  i n  t h e  package, 
shows e x c e l l e n t  hea t  t r a n s f e r  c h a r a c t e r i s t i c s .  
c. Power T r a n s i s t o r s  
A problem has  been encountered i n  t h e  co ld  weld s e a l i n g  
of t h e  11/16" hexagonal composite package for  both t h e  
dua l  d a r l i n g t o n  (L-163) and the  complementary NPN-PNP 
(L-164). 
i n  t h e  cap ceramic during t h e  co ld  weld opera t ion .  
A f r a c t u r e  occurs  c o n c e n t r i c - w i t h  t h e  f l a n g e  
Severa l  approaches a re  be ing  followed t o  e l i m i n a t e  
t h i s  f a u l t :  
1) The cold weld punch i s  b e i n g  modified t o  
minimize inward flow of t h e  displaced 
copper flange. 
minimize ceramic stress. 
2 )  The cap  s t r u c t u r e  i s  be ing  modified t o  
3)  The effect of v a r i a t i o n s  i n  t h e  co ld  weld 
ram speed and t o t a l  load i s  be ing  inves-  
t i g a t e d .  
An e n t i r e l y  d i f f e r e n t  punch design i s  
under cons idera t ion .  
4)  
Device f a b r i c a t i o n  is  cont inuing  on the  steps p reced ing  
t h e  co ld  weld sealing. The dev ices  w i l l  then  be her -  
m e t i c a l l y  sea l ed  a f t e r  t h i s  problem has  been solved.  
Report No. 03-(i6-37 
B. Current Problems and Cor rec t ive  Action 
See sec t ion  on Power Transistors.  
I1 - 5 
i 
C. 
Report ?io. 03-ii(i-37 
Work to be Performed Durinq Next Reporting Period 
I1 - 6 
1. 
2. 
3. 
System 
a. 
b. 
C .  
a. 
Continue testing system at temperature extremes to 
insure performance is satisfactory. 
Continue testing newly packaged variable duty cycle 
one-shots. 
Pot up inductors. 
Finish building final breadboard and begin performance 
testing. 
Flip-Flop Arrays 
a. Categorize and deliver Johnson Counter arrays. 
b. Finish processing of all array types. 
Power Transistors 
a. Correct the ceramic fracture problem: fabricate 
and test devices. 
APPENDIX 
Revisions to Detailed Subassembly Design for 75VA Inte- 
grated S t a t i c  Inverter - Submitted initially 3-1-66. 
, 
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Design, development and delivery of one /1/ breadboard and three /3/ production units of a 75 VA integrated static inverter  Monthly progress report no. 11, Mar. 1966

Design, development and delivery of one /1/ breadboard and three /3/ production units of a 75 VA integrated static inverter Monthly progress report no. 11, Mar. 1966

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