印刷线路板热解过程中溴的迁移实验研究

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Publication date
1 January 2011
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Abstract

选取溴化环氧树脂印刷线路板为原料,通过热重红外联用仪和热解-气相色谱/质谱联用仪对其热解过程中溴的迁移规律进行了研究。结果表明,印刷线路板主要热解温度区间在300～380℃,HB r在最大热失重处释放;PCB热解时,含溴化合物主要有溴甲烷、溴苯酚及2-溴,4-异丙基甲苯

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