Metal-insulator-semiconductor (MIS) structures have been investigated theirs good applications in electronic and optoelectronic. Their importance attributes that they have storage layer property, capacitance effect and high dielectric constant. For this reason, two samples of Si3N4 layers were deposited with plasma-enhanced chemical vapor deposition (PECVD) technique on p-type Si; first is about 5 nm thickness and the other is about 50 nm. The thicknesses of Si3N4 were adjusted by an ellipsometer. It was studied the thickness effect of Si3N4 layers on the Al/Si3N4/p type Si contact and acquired the capacitance-voltage (C–V) and conductance–voltage (G−V) characteristics of the structures in the frequency and applied bias voltage ranges of 10 kHz to 1 MHz and −5 V to +5 V, respectively, at room temperature. Changing of Si3N4 layer thickness could be seen that influenced characterizations of the contacts. In each contact having different insulator layers, capacitance values decreased and conductance values increased with increasing frequencies. The interface states (Nss), the effect of series resistance (Rs), barrier height (Φb) and carrier concentration (Na) were found from characterizations and explained. It was also measured and compared C–V and G−V characterizations dual measurement at 500 kHz in the room temperature for 5 nm and 50 nm thicknesses layers. It could be seen that they have similarly memristor structure and can be used and improved for memory devices.
- Publication date
- 1 January 2017
- Publisher
- Journal of Alloys and Compounds-Elsiever