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research
Direct hot embossing of microelements by means of photostructurable polyimide
Authors
Meriem Akin
Kevin Cromwell
+7 more
Hans Jürgen Maier
Maik Rahlves
Eduard Reithmeier
Maher Rezem
Lutz Rissing
Bernhard Roth
Marc Christopher Wurz
Publication date
1 January 2016
Publisher
Bellingham, WA : S P I E - International Society for Optical Engineering
Doi
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Abstract
While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns. © 2016 Society of Photo-Optical Instrumentation Engineers (SPIE).DFG/CRC/Planar Optronic System
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Institutionelles Repositorium der Leibniz Universität Hannover
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oai:www.repo.uni-hannover.de:1...
Last time updated on 12/08/2017
Crossref
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info:doi/10.1117%2F1.jmm.15.3....
Last time updated on 03/01/2020