CORE
🇺🇦
make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Authors
Muhammad Billah
Matthias Blaicher
+13 more
Philipp I. Dietrich
Wolfgang Freude
Maria L. Goedecke
Joerg Hoffmann
Andreas Hofmann
Tobias Hoose
Christian Koos
Nicole Lindenmann
Pablo Marin
Martin Möhrle
Philipp Simon
Michael Thiel
Ute Troppenz
Publication date
1 January 2016
Publisher
Optica Publishing Group
Doi
Cite
Abstract
We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers
Similar works
Full text
Open in the Core reader
Download PDF
Available Versions
KITopen
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:EVASTAR-Karlsruhe.de:10000...
Last time updated on 07/05/2019
Fraunhofer-ePrints
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:fraunhofer.de:N-422159
Last time updated on 18/02/2017