A. Kurumada

K. Kawamata

S." Sato

T. "Oku

National Institute for Fusion Science (NIFS-Repository)

§46. Evaluations of Thermal Shock Properties for the Joint Material Between Carbon/ Carbon Composite and Oxygen-free Copper Oku, T., Kurumada, A., Kawamata, K. (lbaraki Univ.) Sato, S. (lwaki Meisei Univ.) The purpose of this research is to contribute to the design and development of plasma facing components by evaluating thermal shock properties and observing micro structure of the joint materials by means of arching method. The purpose of this research is to contribute to the design and development of plasma facing components by evaluating thermal shock properties and observing micro structure of the joint materials by means of arching method. The materials used were a carbon-carbon composite (CX-2002U), the rayon felt based carbon composite manufactured by chemical vapor infiltration treatment, and a joint, CX-2002U/Cu (oxygen-free copper). The joint was made using · silver solder (BAg-3) at 690-815°C. In order to reduce the difference of the thermal expansion between carbon and copper , seven layers that consist of copper , steel, copper films, molybdenum sheet, cooper, steel and silver films were placed between carbon and copper blocks. The thermal shock properties and thermal shock toughness were evaluated[1] using disc type specimen by eccentrically local arc heating method. The fracture of CX-2002U/Cu was not seen even at 400 MW/m2 , although CX-2002U itself fractured at about 160 MW/m2 • The values of thermal shock toughness for CX-2002U/Cu was 3.5 times as large as those for ex-2002 u. Fig.1 shows microphotograph of the joint by SEM after thermal shock test. A crack by thermal stress was seen from the mixed layer of copper with CX-2002U to copper film neighbor to molybdenum sheet. Furthermore, an exfoliation was seen on the interface between copper film and molybdenum sheet. However, large through-cracks by thermal stress have never seen in CX-2002U and molybdenum layer. Fig.1 Micro structure of CX-2002U/Cu joint after thermal shock test. References 1) Sato, S., et al., Carbon, 16(1978)103. 51 

Evaluations of Thermal Shock Properties for the Joint Material Between Carbon/Carbon Composite and Oxygen-free Copper

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