Effect of thioglycolic acid and benzotriazole on the cathodic polarization potential during electrocrystallization of copper on copper single crystal planes
For thioglycolic acid (I) [68-11-1], (at concns. ≤10-8M), the η (activation overpotential during Cu [7440-50-8] deposition) variation with time was the same at all c.ds. and the η values were lower as compared with the std. solns.; however, for benzotriazole (II) [95-14-7], at all concns. and c.ds., the change of η with time remained the same and the η values were higher compared to the std. solns. The Tafel slopes exchange c.ds., and type of deposits for deposition of Cu on various crystal planes are given for a std. soln. and with I and II as additives. The additives bring about overpotential and morphol. changes during Cu electrocrystn., and the varying action of the additives is discussed in terms of the adsorption theory
