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带胶剥离工艺粘附性实验研究
Authors
姚飞
成步文
薛春来
Publication date
1 January 2005
Publisher
Abstract
带胶剥离是微电子工艺的常见工艺步骤.文章通过对带胶剥离的样品进行退火实验,研究了电极蒸发金属和不同基底的粘附特性.实验表明,带胶剥离工艺制备的电极,其金属与衬底的粘附性差,退火过程产生气泡,严重影响了器件的特性.蒸发温度、蒸发室真空度,以及基片表面的清洁度与气泡产生有密切的关系.从这几点入手,提出了相应的改进方法
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Last time updated on 29/11/2016