Ultrasonic consolidation (UC) is a novel, solid-state, additive manufacturing
fabrication process. It consists of ultrasonic joining of thin metal foils and contour milling
to directly produce functional components in a variety of geometries. The bond between
layers forms when an ultrasonic horn creates a local oscillating stress field at the mating
surfaces. It is commonly theorized that the high frequency vibration under pressure
produces a metallurgical bond without melting the base material. The mechanism behind
the bond is believed to be due to interfacial motion and friction that disrupts surface
contaminants, arguably allowing direct metal to metal contact, and producing sufficient
stress to induce plastic flow and promote the growth of grains across the mating surfaces.
Ignored in this explanation is the role of substrate dimensions on the quality and strength
of the joining process. Researchers have previously examined the effective height
limitations of the build process, i.e., the limiting height to width ratio of one of the
component features being fabricated. This paper extends the experimental work on using
support materials to extend build height on specimens using two different candidate materials, tin bismuth, and a mixture of sugar, corn syrup, and water, referred to as
“candy”. Tin bismuth and candy the represent the extremes of a tradeoff between
convenience and stiffness that a support material must possess.Mechanical Engineerin
