Current research has demonstrated the use of Ultrasonic Consolidation (UC) to embed
several USB-based sensors into aluminum, and is working toward embedding suites of
sensors, heaters and other devices, connected via USB hubs, which can be monitored and
controlled using an embedded USB capable processor. Additionally, the research has
shown that electronics can be embedded at room temperature, but with some inter-layer
delamination between the ultrasonically bonded aluminum layers. Embedding sensors
and electronics at 300o
F to overcome the delamination issues resulted in optimal
bonding, and the sensors used thus far have functioned normally. Future investigation
will explore other UC parameter combinations to ascertain the quality of embedding at
lower temperatures.Mechanical Engineerin
