Verfahren zum strukturierten Aufbringen einer thermoplastischen Paste auf ein Substrat und dessen Verwendung

Abstract

DE1004056492 B UPAB: 20060825 NOVELTY - The method involves exhibiting a temperature by a printing block, at which the paste is fluid so that the paste flows into a recess and releases from the recess during transfer of a transfer medium (3). The medium exhibits another temperature, at which the paste takes up a dimensionally stable state. The substrate exhibits third temperature, at which the paste is transferred from the medium to the substrate and the paste remains stable. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an application for the method for structured application of a metal contained thermoplastic paste on a substrate. USE - Used for structured application of a metal contained thermoplastic paste on a substrate (claimed). Can also be used for superimposing metallic contacts, electrical conducting, dielectric or electrical isolating structures on an uneven substrate surfaces in the thick film technologies, and for super imposing electrical conducting contacts and structures on solar cells. ADVANTAGE - The method enables to provide improved transmission of the metal contained thermoplastic paste on the substrate, in the context of the pad printing or indirect applied on the thickfilm technology and gravure printing. The method enables to superimpose fine contact structure on the substrate. The method enables to achieve the contact structure breadth of below 50 micrometer and thickness of more than two micrometer