Verfahren und Vorrichtung zur Herstellung einer Lotverbindung zwischen zwei im Wesentlichen nicht metallisch leitenden Bauteilen

Abstract

WO 2009076930 A2 UPAB: 20090707 NOVELTY - Method for producing a soldered connection between two components (1, 2) comprises applying a layer of solder (5) to one component. It is then melted by passing a current between two electrodes (6a, 6b) in contact with it. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for apparatus for carrying out the method comprising a movable gripper (4) for one of the components and electrodes on the other or attached to the gripper. USE - Mounting semiconductors on circuit boards. ADVANTAGE - Heat transfer is localized to the zone in which the connection is made