Military and commercial interest in the use of power electronics for applications
requiring extreme operating conditions and/or placement in extreme environments is
driving research to identify and develop packaging technologies that can withstand
these conditions. Specifically, there is an interest in the development of packaging
technology than can function reliably under transient high power loading conditions.
This thesis addresses the unique packaging considerations required for this type
of application, with a focus on the implications on the durability of the die attach
layer. Simulations of the thermal conditions experienced at the die attach layer for
different power pulse magnitudes and durations are presented. A test apparatus and
experimental test plan for studying the reliability of die attach materials under high
power transient loading is discussed. Studies conducted to validate the test apparatus
and characterize die attach reliability are described along with recommendations for
further investigation of the reliability issues associated with high power, transient
loading conditions
