Low temperature flip-chip process using ICA and NCA (Isotropically and non-conductive adhesive) for flexible displays application

Authors
Publication date
1 January 2002
Publisher

Abstract

Abstract is not available.

    Similar works

    Full text

    thumbnail-image

    Available Versions

    Ghent University Academic Bibliography

    redirect
    oaioai:archive.ugent.be:412064
    Last time updated on 12/11/2016