Hendrickx, Nina

Thienpont, Hugo

Van Daele, Peter

VAN ERPS, J

English

Ghent University Academic Bibliography

Event organizer: Main sponsor: Co- sponsors: Søren Nørlyng Micronsult noerlyng@micronsult.dk Denmark TPC, MarketingTerho Kutilainen Selmic terho.kutilainen@selmic.com Finland EconomyPaul Collander consultant paul@poltronic.fi Finland OC ChairSanna Kutilainen Imbera Electronics sanna.kutilainen@imbera.biz Finland OC SecretaryHans Danielsson consultant hans.danielsson@mbox301.swipnet.se Sweden MemberEero Järvinen consultant eero.jarvinen@kolumbus.fi Finland ExhibitionPentti Karioja VTT pentti.karioja@vtt.fi Finland MarketingSeppo Leppävuori Oulu University sele@ee.oulu.fi Finland MemberPetri Savolainen Nokia petri.jo.savolainen@nokia.com Finland MemberJari Partanen Elektrobit jari.partanen@elektrobit.com Finland MemberHarri Kopola VTT harri.kopola@vtt.fi Finland MemberJohan De Baets IMEC johan.debaets@ugent.be Belgium EMPC2005 ContactGiovanni Delrosso giovanni.delrosso@pirelli.com ItalyDarko Belavic darko.belavic@ijs.si SloveniaTomas Zednicek zednicekt@avx.cz Czech & SlovakJean-Claude Rames jean-claude.rames@mbda.fr FranceGisela Dittmar gisela.dittmar@imaps.de GermanyPal Nemeth nemeth@ett.bme.hu HungaryJacob Hormadely hormadj@bgu.ac.il IsraelAndrzej Dziedzic Andrzej.Dziedzic@pwr.wroc.pl PolandNorocel-Dragos Codreanu norocel.codreanu@cetti.ro RomaniaValery I. Rudakov vir@uniyar.ac.ru RussiaSteve Muckett stevem@mozaik.co.uk United KingdomRolf Aschenbrenner aschenbr@izm.fraunhofer.de GermanyNihal Sinnadurai sinnadurai@aol.com United KingdomSøren Nørlyng noerlyng@micronsult.dk DenmarkEric Beyne IMEC beyne@imec.be Belgium Benelux PresidentJosef Sikula CNRL, Faculty of Electrical Engineering and Communication sikula@feec.vutbr.cz Czech Republic C&S PresidentKarel Kurzweil MCI karel.kurzweil@wanadoo.fr France ELC vice presidentHeinz Osterwinter FHTE Göppingen heinz.osterwinter@hs-esslingen.de Germany ELC TreasurerPeter Gordon Budapest University of Technology and Economics gordon@ett.bme.hu Hungary President Uri Barneah Barkoh Technologies ubarneah@zahav.net.il Israel PresidentGiovanni Delrosso Pirelli Labs Optical Innovation giovanni.delrosso@pirelli.com ItalySoren Norlying MICRONSULT noerlyng@micronsult.dk Denmark Nordic President, AM European EditorJerzy Potencki Wroclaw University of Technology jurpot@prz.rzeszow.pl Poland PresidentPaul Svasta Politechnica University of Bucharest paul.svasta@cetti.ro Romania PresidentSergej Valev Mozaik Technology valev_mozaik@ivtec.ru Russia PresidentMarija Kosec Jozef Stefan Institute marija.kosec@ijs.si SloveniaAndy Longford PandA Europe andy@pandaeurope.com United Kingdom Chairman IMAPS UKPaul Collander Poltronic paul@poltronic.fi Finland ELC PresidentAndrzej Dziedzic Wroclaw University of Technology adziedzic@pwr.wroc.pl Poland ELC SecretaryPeter Barnwell Barry Industries peter@barnwell.org.uk United Kingdom Honorary member of ELCDarko Belavic HIPOT-R&D, c/o Institute Jozef Stefan darko.belavic@ijs.si Slovenia ELC deputy rep.ORGANISING COMMITTEETECHNICAL PROGRAMME COMMITTEEEUROPEAN LIAISON COMMITTEEISBN 978-952-99751-1-2 (paper back.)ISBN 978-952-99751-2-9 (CD-ROM)Inter-plane Coupling Structures for  PCB-integrated Multilayer Optical Interconnections  N. Hendrickx1, J. Van Erps2,  H. Thienpont2, P. Van Daele1 1Ghent University, Technologiepark 914A, B-9052 Ghent, Belgium Phone: +3292645370, Fax: +3292645374, Email: nina.hendrickx@intec.ugent.be 2Vrije Universiteit Brussel, Pleinlaan 2, B-1050 Brussels, Belgium Abstract Optical interconnections gradually find their way towards shorter distances as optoelectronic components become available at affordable costs. To fully exploit the two-dimensional character of the available VCSEL- and detector arrays, multilayer optical interconnects have gained interest over the last years. The multi-layer approach allows increased integration density and flexible routing schemes. In these multilayer structures light can be coupled both between and out of the plane of the optical layers. We present two different approaches to achieve this goal: the first configuration contains laser ablated micro-mirrors, the other one consists of a pluggable inter-plane coupler that can be inserted into laser ablated cavities in a two layer optical structure, which consists of two stacked optical layers, integrated on a printed circuit board (PCB) to couple the light between two subsequent layers. Non-sequential ray-tracing is used to perform a tolerance analysis on the two layer optical structure. The fabrication process of the optical board, the ablated mirrors and the pluggable component are described.  Key words: Coupling Structures, Multilayer Optical Structures, Non-Sequential Ray-Tracing, Optical Interconnections  Introduction Optical interconnections gradually find their way towards shorter distances as optoelectronic components become available at affordable costs. To fully exploit the two-dimensional character of the available VCSEL- and detector arrays, multilayer optical interconnects have gained interest over the last years. The multi-layer approach allows increased integration density and flexible routing schemes. In these multilayer structures light can be coupled both between and out of the plane of the optical layers. The interconnection scheme can in this way be simplified, with less need for passive optical components such as cross-overs. A two layer optical structure, which consists of two stacked optical layers, integrated on a printed circuit board (PCB), is studied. The optical layer contains multimode waveguides, to guide the light in the plane of the optical layer. Two different approaches are presented to couple the light beam between the two layers. The first configuration consists of a two layer optical structure with integrated laser ablated micro-mirrors. The second configuration makes use of a pluggable inter-plane coupler which can be inserted into a laser ablated micro-cavity. In the next sections, we will first discuss the fabrication process of the optical board. The fabrication process of the two coupling structures is then presented. Numerical simulations have been carried out to determine the alignment tolerances in the two layer optical structure. The simulation results will also be briefly discussed.  Two layer optical structure The integration of the optical interconnection on the PCB is done with the use of a polymer optical layer. The optical material has to be compatible with existing PCB manufacturing and soldering processes and should in addition show very good optical properties such as low propagation loss at the targeted wavelength. We study the use of Truemode BackplaneTM Polymer, which is a highly cross-liked acrylate based polymer material with excellent optical, thermal and environmental properties. The main properties are given in Table 1.  Table 1: main properties of the optical material used for the optical layer Propagation loss @ 850nm 0.04dB/cm Refractive index core material 1.5562 Refractive index cladding material 1.5422 Coefficient of thermal expansion  60ppm/K Decomposition temperature > 350°C  65The optical material is spincoated onto the FR4 substrate and in a next step UV-exposed and cured. One optical layer consists of a cladding-core-cladding stack, where the core material has a slightly higher refractive index than the cladding material. The light can in this way be trapped inside the core layer through total internal reflection. The optical layer contains multimode waveguides which are patterned into the core layer using laser ablation [1]. The excimer laser beam is send through a rectangular aperture and projected onto the sample with an optical projection system. The photon energy of the laser beam is used to remove the core material on both sides of the resulting waveguides core. The principle is given in Fig. 1.   1st ablation2nd ablation Figure 1: schematic showing the principle of ablating a waveguide core. The waveguides have a cross-section of 50µm×50µm and are on a pitch of 125µm. The propagation loss at a wavelength of 850nm is 0.12dB/cm which is acceptable for the aimed applications. The waveguide loss is higher than the propagation loss given in Table 1. This is primarily caused by scattering losses that result from the surface roughness of the ablated structures. The average RMS surface roughness of an ablated waveguide is 35nm on a scan area of 49µm×159µm, which is higher than the values obtained for photo lithographical waveguides. Main advantage of using laser ablation is the fact that it is a mask-less technology that can be used for rapid prototyping. This allows us to change the design according to the given specifications in a very flexible way; whereas for photolithography a new mask has to be designed and fabricated each time the design changes. For these reasons, laser ablation is used for the fabrication of the demo optical board. The two layer optical structure consists of a stack of two optical layers. Each layer contains arrays of ablated multimode waveguides, which are aligned with respect to each other with the use of alignment marks placed onto the substrate. The alignment accuracy that can be obtained in this way is better than 5µm, which is in accordance with the results of the alignment tolerance study that has been done with non-sequential ray tracing. The cross-section of a two layer optical waveguide structure is shown in Fig. 2; the results from the numerical study are given in Fig. 3 for the case of a multimode optical fiber (MMF) with core diameter 100µm and NA 0.29 as detector and for the case of a flat detector.  Figure 2: cross-section of a two layer optical waveguide structure.  Figure 3: alignment tolerance of the bottom waveguide in two layer optical structure.  Inter-plane coupling structures Metallized 45° micro-mirrors can be used to deflect the light beam over 90°. The 45° mirror facet is ablated into the optical layer and in a next step Au-coated. The ablated cavity is finally filled with cladding material. The entire process flow is shown in Fig. 4.  A two layer optical structure, which contains a stack of two optical layers, has been studied both experimentally and numerically. Both layers contain multimode optical waveguides and metallized micro-mirrors. The alignment between the different elements in the top and bottom optical layer has to be accurate enough to guarantee a high coupling efficiency. Numerical simulations have been carried out to determine the alignment tolerance curves for the two layer waveguide and mirror structure. The alignment tolerance ranges that are required to obtain an excess loss -1dB are drawn from the tolerance curves. The achievable alignment accuracy of the experimental results can then be compared to the results from this numerical analysis.  ASAP 2005 V2R2 (Breault Research) is used to carry out the simulations. In view of the highly multimodal character of the considered structures, non-sequential ray tracing is used. Light with a wavelength of 850nm is coupled into the ablated Truemode multimode waveguide, which has a 66numerical aperture (NA) of 0.3, with a MMF with core diameter 50µm and NA 0.2. The light is deflected over 90° using metallized 45° micro-mirrors and is coupled from one layer to the other, with maintenance of the propagation direction. A MMF with core diameter 100µm and NA 0.29 is used to detect the outcoupled power. An optical microscope picture of a cross section of the studied two layer optical structure is given in Fig. 5. The tolerance curve for a misalignment of the top mirror with respect to the bottom mirror is given in Fig. 6. The alignment tolerance range from the ideal position for an excess loss ≤1dB along the propagation direction is [-10µm, 10µm].    (a)  (b)  (c) Figure 4: process flow used to integrate the metallized mirror into the optical layer.  Figure 5: cross-section of a two layer optical structure with metallized mirrors.  Figure 6: The alignment tolerance of the top and bottom mirror for a misalignment along the waveguide direction for the case of a flat and MMF detector.  Pluggable inter-plane coupling component The optical layers contain arrays of multimode waveguides which are used to guide light in the plane of the optical layer. The coupling of light from a waveguide in one layer towards the corresponding waveguide in the other layer can be done with a pluggable inter-plane coupler. Two designs can be used: the first one redirects the light beam from one layer to the other with preservation of the propagation direction; the other one in addition also changes the propagation direction. Both principles are given in Fig. 7.  The pluggable coupler contains two 45° micro-mirrors and is patterned in PMMA with Deep Proton Writing [2]. It consists of the following processing steps. First a collimated 8.3MeV proton beam is used to irradiate an optical grade PMMA sample according to a predefined pattern by translating the PMMA sample, changing the physical and chemical properties of the material in the irradiated zones. As a next step, a selective etching solvent is applied for the development of the irradiated regions. This allows for the fabrication of (2D arrays of) micro-holes, optically flat micro-mirrors and micro-prisms, as well as alignment features and mechanical support structures. On the other hand, an organic monomer vapor can be used to expand the volume of the bombarded zones through an in-diffusion process. This enables the fabrication of spherical (or cylindrical) micro-lenses with well-defined heights. If necessary, both processes can be applied to different regions of the same sample, yielding micro-optical structures combined with monolithically integrated micro-lenses. We use high molecular weight PMMA with a thickness of 500µm, which allows the 8.3MeV protons to completely traverse the sample. During the irradiation step, the PMMA sample is semi-continuously translated perpendicularly to the beam 67in steps of 500nm using high-precision translation stages with an accuracy of 50nm. Optimal surface roughness results are obtained by using a proton dose of 50pC per step of 500nm, with a proton current of 160pA. The fabricated components are shown in Fig. 8 and Fig. 9. Au coating can consequently be evaporated on the micro-mirror facet to increase the coupling efficiency.   claddingcoresubstrate claddingcoresubstrate Figure 7: Schematic principle of pluggable inter-plane coupling structures preserving the propagation direction (top) or inverting the propagation direction (bottom) The thickness of cladding and core layer has to be identical in top and bottom optical layer, and has to correspond to the values used for the design of the coupler in order to guarantee a high coupling efficiency. The coupling component is inserted into a micro-cavity that is ablated into the two layer optical structure. There is always a certain degree of tapering during the ablation, which also causes the slightly trapezoidal form of the waveguides, which can be measured experimentally and corrected for. The ablated cavity thus has one vertical wall and one wall with the double tapering angle. The insert is placed against the vertical wall, which is in fact the output facet of the waveguides. When the discrete coupler is plugged into the micro-cavity, it has to be aligned with respect to the waveguides. Active alignment is used for this purpose.  For the characterization of the critical optical surfaces of the component, namely the entrance and exit facet, we use a WYKO NT-2000 non-contact optical surface profiler (Veeco). Since the micro-mirrors themselves are not accessible with the microscope objective, these surface were not measured, but their surface roughness will be analogous to the two others. The surface roughness analysis reveals that the flat top part has an average local RMS surface roughness Rq of 14.1nm ± 2.7nm measured over an area of 60µm by 46µm. We averaged at least 5 measurements of randomly chosen positions. The flatness Rt or peak-to-valley difference along the depth of 500µm of the component is measured to be smaller than 2.5µm. This is due to the scattering of the protons during the interaction with the PMMA. As a conclusion, we can say that our developed DPW surfaces have a very good and reproducible optical quality: almost flat and a very low RMS roughness. Loss measurements will be performed in the near future to determine the coupling loss of the inter-plane coupling structures. Experimental results will be compared with the results obtained from a numerical study.    Figure 8: Fabricated pluggable inter-plane coupler with preservation of propagation direction: entire component (top) and zoom on mirrors (bottom)  68 Figure 9: Fabricated pluggable inter-plane coupler with inversion of propagation direction  Conclusions We have presented two different fabrication technologies allowing the manufacturing of inter-pane coupling structures for multilayer optical waveguides integrated on a Printed Circuit Board. Laser ablation can be used to create monolithically integrated micro-mirrors in the waveguides. A numerical study has been performed to show us the required alignment tolerance in this case. In a second approach, we make use of Deep Proton Writing for the fabrication of dedicated, pluggable inter-plane coupling components which can be readily inserted in cavities formed in the PCB-integrated multilayer waveguides.  Acknowledgements Nina Hendrickx would like to acknowledge the Institute for the Promotion of Innovation by Science and Technology in Flanders (IWT Flanders) for financial support. Jürgen Van Erps acknowledges the Fund for Scientific Research-Flanders (FWO) for financial support. Part of this work was carried out within the framework of the network of excellence on micro-optics (NEMO), supported by the European Commission through FP6 program.  References [1] G. Van Steenberge, N. Hendrickx, E. Bosman, J. Van Erps, H. Thienpont, and P. Van Daele, "Laser Ablation of Parallel Optical Interconnect Waveguides", Photonics Technology Letters, Vol. 18, no. 9, May, 2006. [2] C. Debaes et al., “Deep proton writing: a rapid prototyping polymer micro-fabrication tool for micro-optical modules”, New Journal of Physics, vol. 8, 270, 2006. 69

Inter-plane coupling structures for PCB-integrated multilayer optical interconnections

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Inter-plane coupling structures for PCB-integrated multilayer optical interconnections

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Ghent University Academic Bibliography