'Institute of Electrical and Electronics Engineers (IEEE)'
Doi
Abstract
We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate
