GENGENBACH, U

KARIOLA, P

Van Daele, Peter

Undetermined

Ghent University Academic Bibliography

  Workshop on Micro-Optics – Benefits for Industry 7th April 2006 Photonics Europe  Strasbourg, France Book of Abstracts     Program Time Title Speaker 9.00 NEMO - a powerful tool for micro-optics in Europe  NEMO - the European Network on Micro Optics, an overview Hugo Thienpont (VUB)  NEMO Industrial User Club (IUC) Tomasz Nasilowski (VUB)    9.40 NEMO's service centres 1 - capabilities and services to industry  Centre for modelling of micro-optical components Norbert Lindlein (FAU)  Centre for fabrication of micro-optical systems  Jürgen Mohr (FZK)    11.00 NEMO's service centres 2 - capabilities and services to industry  Centre for measurement of micro optical components and new measurement tools Malgorzata Kujawinska (MWUT)  Centre for assembly & packaging  of micro optics Peter van Daele (UG)  Centre for reliability & standardization issues  Oliver Kraft (FZK)    13.15  Food Chain in Micro Optics 1: Fibre sensors   Fibre sensors for strain & temperature measurement  Tomasz Nasilowski (VUB)  Simulation, Fabrication and Characterization of new fibres for sensor applications Waclaw Urbanczyk (WRUT)    14.10 Food Chain in Micro Optics 2: Micro Lenses   Use and advantage of micro lenses in imaging applications Jacques Duparre (IOF)  Simulation, fabrication and characterization of micro lenses and lens arrays Heidi Ottevaere (VUB)    15.30 Application fields of micro optics   Optical interconnects at the PCB level Peter van Daele (UG)  Diffractive and sub-wavelength micro-optics for light management Martin Salt  (HEPT)  Infrared micro optics Peter Muys (LROE)  Emerging applications in Micro Optics Olivier Parriaux (CNRS-TSI)    16.50  Summary & conclusions IUC Tomasz Nasilowski (VUB)  NEMO Workshop "Micro-Optics for Industry", April 7, 2006, Strasbourg3 von 34Assembly and packaging of micro optical systems  Peter Van Daele, Ghent University, INTEC Dept – TFCG-Microsystems Technologiepark bldg 914A, B-9052 Zwijnaarde, Belgium e-mail: peter.vandaele@intec.ugent.be  Pentti Karioja, VTT, Finland Ulrich Gengenbach, FZK, Germany  Packaging of optical and opto-electronic components very often makes up the largest portion of the cost of the final component. This is not only caused by the fact that alignment issues are much more critical when playing with optical inputs and outputs in addition to electrical input and output, but also due to the lack of standardization. In electrical packaging, much of the packages and the processes to be used is standardized and is identical, no matter what functionality the electrical component has. This is not the case for optical or opto-electronic components, where packaging is largely determined by the functionality. As an example one can take the case of fiber-pigtailing a laserdiode: in the case of a VCSEL, the process, technology, package,… is completely different from the case for an edge-emitting laserdiode.  Just as in the case of the electronic industry, several levels are defined within the optoelectronic assembly and packaging world. The IPC identifies 4 levels in its roadmap “Optoelectronic Assembly and Packaging Technology”: - Level 0 (uncased device): Lasers, LEDs, photodiodes, fibres, micro-lenses, waveguide chips, etc. are basic devices needed for optoelectronic modules and systems. - Level 1 (packaged device): When devices have some features added, such as, a laserdiode is encapsulated in a hermetic TO can or a fibre is equipped with a micro-lens or ferrule, we are dealing with packaged devices.  At this level, issues such as alignment and sealing are envisaged. Solutions might be based on existing technologies, such as, soldering of metallised micro-optical components.   - Level 2 (modules): Module level is reached when several functional devices or components are integrated in a single package. Good examples of optoelectronic modules are fibre optic transmitters, wavelength multiplexers/ demultiplexers, splitters and couplers,…. This level of assembly requires a much more robust level of assembly (accuracy about 1 to 2 um) and a different level of sealing, as the facets of optical waveguides should be protected. New tools for handling these micro-optical sub-assemblies and mounting technologies, probably based on Flip-Chip technologies should be deployed or adapted. - Level 3 (board-level): The final interface of the optical module towards the outer world will, in most cases, be an optical fibre. The presentation will also present the capabilities of the NEMO NoE in these different levels of packaging and integration.  NEMO Workshop "Micro-Optics for Industry", April 7, 2006, Strasbourg15 von 34Centre for assembly & packaging  of micro opticsPeter Van Daele (Univ. Gent, B)Pentti Karioja (VTT, SF)Overview• Introduction• Levels of Packaging• Processes• NEMO Capabilities• ConclusionsPackaging is the car around the enginePackaging is the car around the engineProcessing yields naked chipsProcessing yields naked chipsIntroduction• difficult to characterise, handle and use• subject to environmental influencesIntroduction• Packaging electronic components– protect against environmental influences (passivation) – only electrical contacts– no accurate alignment needed– thermal housekeeping• Packaging optical & optoelectronic components– Optical coatings– optical “contacts” : fibre alignment & micro-optics– temperature controlextreme accurate alignment neededup to 80% or 90% of the total cost!IntroductionDoes this looks cheap?IntroductionTo cope with large I/O:– DIP: Dual-in-Line Package– PGA: Pin Grid Array– SOP: Small Outline Package– QFP: Quad Flat Package– LCC: Leadless Chip CarrierDIPPGA SOPQFPLCC• Packaging electronic componentsFunctionality has limited influence on packagingIntroduction• Packaging optical & optoelectronic componentsFunctionality determines packagingFiber pigtailingVCSELEdge emitterOverview• Introduction• Levels of Packaging• Processes• NEMO Capabilities• ConclusionsLevels of packaging1. Devicenaked chip, tested or not tested2. Componentassembled chip and possibly locally encapsulated 3. Modulechips, components integrated into a functional unit4. Systemmodules integrated into a functional unit Processes• Die bonding:– to fix Chips – electrical contact– alignment• Wire bonding:– electrical contacts to package pinswedge-bondingProcessesOut of requirement to cope with large I/O:– all contacts on the outer edge• smaller chips " smaller surface " less space– demand for increased I/O" Flip-Chip technologyProcessesHigh density Au Flip-ChipPitch   12.5 μmDiameter  6.25 μmProcesses• What can Flip-Chip do for Optoelectronics?70-100 μmLASERDIODE125 μmOPTICAL FIBERcore< 10 μmepoxyProcesses• Flip-Chip controls height of active layer70-100 μmLASERDIODE125 μmOPTICAL FIBERcore< 10 μmbumpsheight bumps thickness epilayers?ProcessesLaserarrayfiberscontactsCoupling flip-chip mounted edge-emitting laser-arrays to optical fibersProcessesMode mismatchOptical fiberActive arealaserdiodeTapered sectionActive areaOverview• Introduction• Levels of Packaging• Processes• NEMO Capabilities• ConclusionsWP3Replication3eplicationWP5Reliability5eliabilityWP1Modeling & Design1odeling  esignWP6Stand.6tand.WP4Packaging4ackagingWP2Meas.2eas.System integrationSub-assemblyModuleSub-assemblyDeviceNEMO Capabilities• Assembly & Integrated related Design & Modeling• Materials tailoring• Optical, surface, mechanical, thermal charact.• Fabrication techniques• Packaging– Substrate (Ceramic, Polymer, PCB, SC,…)– Bonding– Sealing (encapsulation)– Assembly• Pick & place• Microassembly (non standard)• Fiber handling• Reliability testing•Laser patterning•CNC•UV lithography•Holography•Dicing•Precision machining•PatterningFlip-chip bondingWireDieDispensingWafer bondingBumpingLaserVibrationTemperature cyclingHumidityEMCLeakAlignment structures• Grooves tooled by standard via punching and lamination processFiber alignment accuracy ~±3 µm (vertical to substrate, horizontal to alignment marks)Conductive adhesiveCathode padLaser chipFiberLayer 1Layer 2Layer 4Layer 3Anode contactV-groove with flexible foils, (SM fiber) Rectangular groove with steel foils, (SM fiber)• Grooves made by photolithography using photo-definable paste materialsFiber alignment accuracy <±3 µm (vertical to substrate, horizontal to alignment marks)62.5/125 µm fibers, vertical tolerance ±1.6 µm Application:Fiber pigtailingPassive optical alignmentMultimode fiberVCSEL / PhotodiodeIntegrated electronicsRemovable MT-like connector(8 fibers, pitch 250 μm)1x8 VCSEL-array (λ = 670 nm)• Vertical emitting laserdiodesFiber pigtailingAssembly• Coupling to optical layer in PCB’sASSEMBLY OF MICROLENS ARRAYONTO AN LTCC-BASED VCSEL-ARRAY TRANSMITTER1. Two microlens arrays stacked together by gluing the substrate back-sides with index-matched adhesive=> double-sided microlens array 2. Double-sided microlens array glued to LTCC substratesubstratesubstrateadhesiveVCSEL-arrayLTCC substratevacuum grippercavity on LTCCsubstrate Stacked micro-lens arraysFlip-chipped VCSEL arrayAssembly of microoptical systemsall by ForschungszentrumKarlsruhe -IMT-Microoptical duplexerHeterodyn receiverFiber switchpiezosystemejenaOptical-SMDEPFL LausanneCollimatorFhG IOF, JenaTask: Transfer of laboratoryfabrication to semi- or fully automaticseries fabricationExamples of hybridmicrooptical devicesProximity sensor(first laboratory sample)AssemblyAssembly of  microoptical systemsPassive assemblyEtch grooves for centeringballs (ø 650 µm)Passive alignment:Selfalignment of ball inetch grooveAssembly of centering ballsAssemblyAssembly conceptAssembly tasks:- Insertion of cylinder lenses into amicrooptical board- Mounting of centering balls onto anelectronic-optical board- Assembly of microoptical and electronic-optical boardAssembly conceptPassive alignment of components to be mounted onwell defined and precisely fabricated stop facesMikrooptische BankLinsenZentrierkugelnElektronisch-optischePlatteMicroopticalboa dCylinder lensesCe ering ballsElec i -opticalboardAssemblyIntegration of alignment featuresinto design of microoptical boardExample: Tray for micro optical boardTray with sixmicrooptical boardsDesign for assembly!Feeding of componentsAssembly• Modular, high precision assembly machine MIMOSE - Cartesian system (x,y,z,∅)- workspace 200 x 200 x 70 mm³, 360°- repetitive accuracy < 5 µm (resolution 1 µm) - payload 5 N• Feeding of components with standardised2” - 8” trays (DIN 32561)• Depending on configuration proprietary or standard tool change system (DIN 32561)• Various suction grippers and miniaturisedadhesive dispensers• Optional image processing system (DIPLOM)• Minienvironment (up to class 1000)EquipmentMultifunction gripper with multiple suction orifices• Suction orifices on common vacuum supply• Suction orifice 1: Gripping for shearing of lenses from wafer• Suction orifice 2: - Gripping of lenses after reversal- Gripping of centering ballsSuction orifice 2Suction orifice 1 MultifunctiongripperLens substrateon trayEquipment   Etch grooves for centering balls (ø 650 µm)Example: Mounting of centering balls onto electro-optical boardTray with electronic opticalboardsGripperElectronic-opticalboardPassive alignment: Self centering of ballin etch grooveMultifunction gripper with multiple suction orificesEquipmentEquipmentAdhesive Dispenseradhesive dots on a waferEquipmentWafer bonding : SUSS MA61st wafer2nd wafer with adhesive dotsafter alignment UV curing of the adhesiveHermetic encapsulationKovar lid, sealing with laser Encapsulated & pigtailed LTCC module BGA-assembled on PCBHermetic fiber feedthrough by the use of solder glass preformPhotonics sub-assembly based on LTCC boardKovar frame, solder reflow sealing to LTCC using integrated resistance heating element or reflow ovenConclusionsPackages allow components to be used• Wide range of possible packages & techniques• Optimise technologies for optical packaging• Costs are extremely highMuch research still to be doneLook around and be creative !!uch research still to be doneLook around and be creative !!

Assembly and packaging of micro optical systems (invited)

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Assembly and packaging of micro optical systems (invited)

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Ghent University Academic Bibliography