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Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components

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Publication date
1 January 2013
Publisher
'Institute of Electrical and Electronics Engineers (IEEE)'
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    Abstract

    We report the Laser-Induced Forward Transfer (LIFT) of micro-bumps of silver nanoparticle and solder based paste for flip-chip bonding of single VCSEL chips. The electrical characterization results of the bonded chips are also presented

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