Our biocompatible packaging concept for implantable electronic systems combines biocompatibility, hermeticity and extreme miniaturization. In a first phase, all chips are encapsulated in order to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. Various clean room materials are tested with respect to their suitability as encapsulation material. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using eg. gold or platinum. Device assembly is the final packaging step, during which all system components will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS
