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Wetting dynamics at high values of contact line speed

Abstract

Experimental results analyses of dynamic contact angle change under the conditions of substrate wetting by distilled water at high values of the contact line speed was conducted. Three spreading modes for copper substrates with different roughness were selected: drop formation, spreading and equilibrium contact angle formation. Peculiarity of droplet spreading on superhydrophobic surface is found. It consists in a monotonic increase of the advancing dynamic contact angle. The effect of the drop growth rate on the value of the dynamic contact angle is found

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