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Electromigration Behavior of 3D-IC TSV
Authors
Lorena Anghel
L. Arnaud
+6 more
C. Chappaz
T. Frank
P. Leduc
F. Lorut
S. Moreau
Aurélie Thuaire
Publication date
18 September 2011
Publisher
'Institute of Electrical and Electronics Engineers (IEEE)'
Abstract
International audienc
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HAL Université de Tours
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