CORE
🇺🇦
make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
Sn-3.5Ag合金在Cu,Ni倾斜基板的润湿及界面特性
Authors
周舟
张军玲
+5 more
徐红艳
战亚鹏
王晨钰
袁章福
赵宏欣
Publication date
1 January 2011
Publisher
Abstract
良好的润湿性是优质焊料的重要指标,同时也可以为复合无铅焊料的开发提供必要的研究基础。而工业过程中的操作表面往往是倾斜的,因此,研究倾斜状态下的润湿特性更能反映实际情况。本文采用静滴法研究了不同温度下Sn-3.5Ag合金熔体在Cu,Ni材料水平基板和倾斜基板上的润湿行为与界面相互作用,分析了润湿机理。结果表明,Sn-3.5Ag合金与固体Cu基板在(494~744)K时的平衡接触角为139.2°~33.3°,接触角滞后为82.1°~47.8°。Sn-3.5Ag合金与固体Ni基板在(494~744) K时的接触角分别为140.8°~41.5°,接触角滞后为92°~60.9°。在不同温度下Sn-3.5Ag合金熔体在不同温度下与固体Cu基板之间有良好的润湿性且为反应性润湿。Sn-3.5Ag熔体与基板Cu之间的界面产物是由Cu_6Sn_5及Cu_3Sn所组成。用三相界面平衡的界面张力关系式分析了Sn-3.5Ag合金与Cu基板的三相界面,符合较好。Sn-3.5Ag对Ni基板的润湿过程也是反应性润湿
Similar works
Full text
Available Versions
Institutional Repository of Institute of Process Engineering, CAS (IPE-IR)
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:ir.ipe.ac.cn:122111/45625
Last time updated on 11/04/2021
Institutional Repository of Institute of Process Engineering, CAS (IPE-IR)
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:ir.ipe.ac.cn:122111/37716
Last time updated on 05/12/2019
Institutional Repository of Institute of Process Engineering, CAS (IPE-IR)
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:ir.ipe.ac.cn:122111/10703
Last time updated on 09/11/2016