The new fast wire scanner foreseen to measure small
emittance beams throughout the LHC injector chain will
have a wire travelling at a speed of up to 20 m.s-1, with a
requested wire position measurement accuracy in the
order of a few microns. The vibration of the thin carbon
wires used has been identified as one of the major error
sources on the wire position accuracy. One of the most
challenging and innovative developments in this project
has been the work to quantify the effect of wire vibrations
and fork deformation. The measurement strategy for the
former is based on the piezo resistive effect of the wire
itself, while the deflection of the fork supporting the wire
has been measured by semiconductor strain gauges.
Dynamic models of the wire and fork have been created
to predict the behaviour of the fork-wire assembly and
will be used for its optimisation. This contribution will
discuss the measurement setup and the model
development as well as their comparison. In addition it
will show that this technology can easily be implemented
in current operating devices without major modifications.Postprint (published version