Two-dimensional arrays of emissive micro-light-emitting diodes (μ-LEDS) have been developed for a variety of applications such as high resolution micro-displays, maskless photo-lithography and multichannel visible-light optical communications amongst others. μ-LEDs have traditionally been
fabricated on InGaN LED wafers grown on transparent sapphire substrates, and have suffered from optical crosstalk issues. When a single pixel is addressed, adjacent pixels and regions appear
illuminated simultaneously. Such problems could result in functional failure in high-density μ-LED
applications, including reduced resolution of micro-display and decreased signal-to-noise ratio in ...postprin
